Substrate Manufacturing

Substrate Manufacturing

KLA’s substrate manufacturing portfolio includes defect inspection and review, metrology and data management systems that help substrate manufacturers manage quality throughout the wafer fabrication process. Specialized wafer inspection and review tools assess wafer surface quality and detect, count and bin defects during production and as a critical part of outgoing wafer qualification. Wafer geometry systems ensure the wafer shape is extremely flat and uniform in thickness, with precisely controlled wafer shape topography. Data analysis and management systems proactively identify substrate fabrication process excursions that can lead to yield loss. KLA’s substrate manufacturing systems support process development, production monitoring and final quality check of a broad range of substrate types including silicon, prime silicon, SOI, sapphire, glass, GaAs, SiC, GaN, InP, GaSb, Ge, LiTaO3, LiNBO3, and epitaxial wafers.

Categories

Surfscan®

Interested in this product or have questions?
Contact Us

Surfscan®

Unpatterned Wafer Defect Inspection Systems

The Surfscan® SP7 unpatterned wafer inspection system supports leading-edge logic and memory design nodes through qualification of: processes, materials and tools, including those for EUV lithography, for IC manufacturing; advanced substrates, such as prime silicon, epitaxial, and SOI wafers, for substrate manufacturing; and process tool performance for equipment manufacturing. Using a DUV laser source with peak power control, a novel optical architecture, a range of spot sizes and advanced algorithms, the Surfscan SP7 delivers ultimate sensitivity and enhanced defect classification at high throughput for bare wafers, smooth and rough films, and fragile resists and litho stacks. The Surfscan SP7 also integrates a high resolution SURFmonitor™ module that characterizes surface quality and detects subtle defects, helping qualify processes and tools.

Applications

Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, EUV resist and scanner qualification, Process debug

Related Products

Surfscan SP5XP: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 1Xnm design nodes.

Surfscan SP5: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2X/1Xnm design nodes.

Surfscan SP3: Unpatterned wafer inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2Xnm design node.

Interested in this product or have questions?
Contact Us

eDR7xxx

Interested in this product or have questions?
Contact Us

eDR7xxx

e-Beam Wafer Defect Review and Classification Systems

The eDR7380™ electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects, producing an accurate representation of the defect population on a wafer. With a wide range of electron optics and a dedicated In-Lens Detector, the eDR7380 supports defect visualization across process steps, including fragile EUV lithography layers, high aspect ratio trench layers and voltage contrast layers. Unique Simul™-6 technology produces a complete DOI pareto in one test for accurate defect sourcing and faster excursion detection. With connectivity features, such as IAS™ for broadband optical patterned wafer inspectors and OptiSens™ for bare wafer inspectors, the eDR7380 provides unique linkage to KLA inspectors for faster yield learning during IC and wafer manufacturing.

Applications

Defect imaging, Automatic inline defect classification and performance management, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Hotspot discovery, Defect discovery, EUV print check, Process window discovery, Process window qualification, Bevel edge review.

Related Products

eDR7280: Electron-beam wafer defect review and classification system with fifth-generation e-beam immersion optics for ≤16nm design node IC development and production.

eDR® is a registered trademark of KLA Corporation.

Interested in this product or have questions?
Contact Us

WaferSight™

Interested in this product or have questions?
Contact Us

WaferSight™

Bare Wafer Geometry Metrology Systems

The WaferSight™ 2+ bare wafer geometry metrology system qualifies polished and epitaxial silicon wafers, and engineered and other advanced substrates for wafer manufacturers. By producing wafer flatness, dual-sided nanotopography and high-resolution edge roll-off data, the WaferSight 2+ produces the data that helps wafer manufacturers ensure that first quality substrates are being produced in volume production.

Applications

Wafer process monitoring and control, Outgoing wafer quality control

Interested in this product or have questions?
Contact Us

FabVision®

Interested in this product or have questions?
Contact Us

FabVision®

Data Management for Wafer Fabrication

FabVision® data management software provides real-time data management for wafer and substrate manufacturers. FabVision continuously monitors, reports and manages product quality, inspection and metrology information. Wafer fabrication process excursion alerts, daily reports and selected data can be sent automatically worldwide to better manage operations. The integrated database enables quick analysis and response to inquiries about product history and quality. With real-time wafer production information, FabVision produces the data needed by management, engineering and operations to proactively detect wafer fabrication process excursions that can lead to yield loss.

Applications

Yield analysis, Wafer defect data management, Wafer fabrication process monitoring, Outgoing wafer quality control

Interested in this product or have questions?
Contact Us

Candela® 8xxx

VCSEL array image courtesy of Philips Photonics

Interested in this product or have questions?
Contact Us

Candela® 8xxx

Advanced Surface Inspection for Compound Semiconductor Materials

The Candela® 8720 compound semiconductor material surface inspection system enables GaN-related materials, GaAs substrate and epi process control with high sensitivity to critical defects for production of power devices, communications and RF devices, and advanced LEDs (as well as upcoming microLEDs). With its proprietary optical design and detection technology, the Candela 8720 detects and classifies sub-micron defects that are not consistently identified by current inspection methods, supporting production-line monitoring for yield-limiting defects.

Applications

Process monitor, Tool monitor, Quality control

Related Products

Candela® 8420: Surface inspection for compound semiconductor materials.

Interested in this product or have questions?
Contact Us

Candela® CS920

Interested in this product or have questions?
Contact Us

Candela® CS920

Integrated Solution for Surface Defect Detection and Photoluminescence Metrology

The Candela® CS920 SiC substrate and epitaxy (epi) wafer surface defect inspection system for power device manufacturers provides full-surface, high-sensitivity defect inspection and accurate process feedback. This epi wafer surface defect detection system helps the industry improve SiC substrate quality, as well as optimize the epitaxial growth yields for both SiC epi and GaN-on-silicon processes. The CS920 enables significantly enhanced yield and reduced time-to-root cause by integrating surface defect detection and photoluminescence technology in one inspection platform capable of capturing yield-critical defects including sub-surface basal plane dislocations and all epi stacking faults.

Applications

Process monitor, Tool monitor, Incoming quality control, Outgoing quality control

Interested in this product or have questions?
Contact Us

Candela® 71xx

Interested in this product or have questions?
Contact Us

Candela® 71xx

Hard Disk Drive Media and Substrates Defect Inspection and Classification Systems

The Candela® 71xx Series advanced media and substrate defect detection and classification system for hard disk drive manufacturing helps maximize yield and lower hard disk inspection cost. A dual optical path configuration enables classification of unique defect signatures for critical submicron defects, such as micro-pits, bumps, particles and buried defects. The Candela 7110 configuration supports manual loading of substrates for inspection, while the Candela 7140 provides fully automated cassette-to-cassette substrate loading.

A high sensitivity (HS) option provides enhanced sensitivity and capture rate for both bare glass and metal substrate inspection.

Applications

Hard disk drive process and tool monitoring

Interested in this product or have questions?
Contact Us

Candela® 63xx

Interested in this product or have questions?
Contact Us

Candela® 63xx

Hard Disk Drive Media and Substrates Topography Measurement and Defect Inspection System

The Candela® 63xx dual laser-based inspection system provides surface inspection of hard disk drive substrates and finished media. Its unique multi-channel optical design enables roughness and waviness metrology measurements on both smooth metal and glass substrates. Defects, such as particles and scratches, can be automatically detected and classified using the same platform. The Candela 6310 is a manual system suited for both laboratory and low volume production, while the Candela 6340 is a fully automated cassette-to-cassette system for production environments.

Applications

Hard disk drive process and tool monitoring

Interested in this product or have questions?
Contact Us

Ready to get started?

Contact Us

Are you sure?

You've selected to view this site translated by Google Translate.
KLA China has the same content with improved translations.

Would you like to visit KLA China instead?


您已选择查看由Google翻译翻译的此网站。
KLA中国的内容与英文网站相同并改进了翻译。

你想访问KLA中国吗?

If you are a current KLA Employee, please apply through the KLA Intranet on My Access.

Exit