A long open road in the forest

Accelerating Reliability for Automotive ICs

Semiconductors are at the core of innovation in today’s automobiles

Continuous Improvement Program

A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.

Surfscan® Series

Drive to Zero Defect

With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab, where cost is lowest. A high sensitivity inspection strategy can partner with screening techniques to enable discovery of yield-critical defects for faster characterization of new processes and additional defect reduction.

8 Series

C205

Puma

Certified & Remanufactured

I-PAT®

Advanced Design Node Inflection

Automotive features such as machine vision and AI require advanced ICs. To attain higher yield and quality standards for advanced design node devices, fabs require discovery of all systematic defect sources and an “every defect matters” approach to improving baseline yield.

39xx Series and 29xx Series

Voyager® Series

eSL10™

eDR7xxx™ Series

Enhanced IC Packaging and PCBs

Today’s advanced packaging technology relies on innovative process techniques to provide improved IC component performance and multi-function integration. To prevent defective devices from moving forward in the supply chain, screening and sorting are important quality control steps for packaged IC components, IC substrates and printed circuit boards (PCBs). Inspection and metrology systems capture critical defects and variations for the continuous improvement of packaging and PCB processes, reliability-related issues and device failure traceability.

Packaging Manufacturing

Orbotech PCB Inspection

Power Device Reliability

Implemented in a wide range of automotive subsystems, power devices require the same quality standards as other automotive ICs. Specialized equipment for SiC epitaxy and GaN-on-silicon processes, and inspection systems for SiC substrates help manufacturers of power devices achieve automotive defect standards.

SPTS Power Device Manufacturing

Power Device Process Control

I-PAT®

I-PAT (Inline Defect Part Average Testing) is a new method that allows automobile manufacturers to reduce the incidence of latent reliability defects in semiconductor electronic components, recognize at-risk die for exclusion from the supply chain and reduce the incidence of escapes of die that will fail prematurely from the fab. (I-PAT patent pending)

I-PAT Fact Sheet

Black and blue printed circuit board with car icon on the processor

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Automotive Papers and Commentary

Semiconductor Engineering / Feb 2021
Part Average Tests for Auto ICs Not Good Enough

Semiconductor Engineering / Feb 2021
Automotive Test Moves In-System

Semiconductor Engineering / Feb 2021
Why Improving Auto Chip Reliability Is So Hard

Semiconductor Engineering / Nov 2020
Chips Good Enough to Bet Your Life On

Power Electronics World / Jul 2020
KLA Corp. Focuses on Next-Gen Solutions for Power Applications

Autonomous Vehicle Technology / Sep 2019
Semiconductors Shift to Ensure Greater Auto Reliability

Semiconductor Digest / Sep 2019
Process Watch: A Statistical Approach to Improving Chip Reliability

Semiconductor Engineering / May 2019
Gaps Emerge in Automotive Test

Automotive Electronics Council Reliability Workshop / Apr 2019
Toward Zero Defect: Automotive Fab Best Practices for Assessing “Best Performing Tools”

Automotive Electronics Council Reliability Workshop / Apr 2019
Practical Applications of “Measurement Systems Analysis” (MSA) for Semiconductor Process Control

Semiconductor Engineering / Apr 2019
Electric Cars Gain Traction, But Challenges Remain

ECN / Feb 2019
Reliability in Autonomous Driving Systems Starts with Pursuit of Zero Defects

Semiconductor Engineering / Feb 2019
Reliability Becomes The Top Concern In Automotive

Semiconductor Engineering / Jan 2019
Chasing Reliability In Automotive Electronics

Elektronik Automotive / Dec 2018
Zuverlässiger Einsatz von Halbleitern im Kraftfahrzeug

Solid State Technology / Nov 2018
Process Watch: Monitoring for Excursions in Automotive Fabs

Solid State Technology / Aug 2018
Process Watch: Automotive Defect Sensitivity Requirements

Chip Scale Review / Aug 2018
Automotive Apps Are Driving Inspection Requirements for Advanced Nodes

Automotive Electronics Council Reliability Workshop / Apr 2018
Inline Defect Part Average Testing (I-PAT)

Automotive Electronics Council Reliability Workshop / Apr 2018
Latent Reliability Defects in Automotive Chip Packages

Solid State Technology / Mar 2018
Process Watch: Baseline Yield Predicts Baseline Reliability

Semiconductor Engineering / Mar 2018
Finding Faulty Auto Chips

Semiconductor Engineering / Jan 2018
Automotive IC Industry Trends

Solid State Technology / Jan 2018
Process Watch: The (Automotive) Problem With Semiconductors

Semiconductor Engineering / Oct 2017
Radar Versus LiDAR

Evaluation Engineering / Oct 2017
Autonomous Vehicles, New Tech Drive Automotive Test Market

Semiconductor Engineering / Sep 2017
Foundries Accelerate Auto Efforts

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