Enabling 5G Connectivity
Integrated Circuit Quality
Semiconductor IC quality is fundamental to the success of mission-critical, low‐latency 5G services such as autonomous driving and security monitoring. High chip reliability and performance are achieved through implementation of comprehensive process control strategies across the semiconductor ecosystem.
Semiconductor Manufacturing
5G applications are driving increased adoption of electronic devices that utilize RF power amplifiers and high-frequency filters, sensors and MEMS devices. Robust IC process technologies and process control strategies improve chip performance and reliability.
Packaging Advances
New IC packaging architectures with complex levels of integration—system in package (SiP) and fan-out on both wafer and panel—enable the development of 5G devices. Process technologies, including etch, PVD, CVD, and UV laser drilling support the formation of these complex packaging schemes. During packaging processing and after component formation, tighter quality requirements drive the need for accurate inspections at the wafer, die and sub-package levels.
High Density Interconnect PCB
5G-enabled devices require advanced printed circuit boards with finer linewidths, straight sidewall geometry and multiple layers with more stringent quality and reliability requirements. PCB inspection, repair and imaging systems help manufacturers find and repair defective layers and trace the source of defects, increasing the yield and reliability of finished PCBs.
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Explore More Solutions
Artificial Intelligence
AI helps make sense of big data! Our solutions use AI to accelerate production of the very ICs that will power the next generation of AI innovation.
IoT
The Internet of Things is expanding quickly, and the demand for smart devices is growing with it! Our solutions drive increasing production to match it.
Automotive
Navigation, infotainment, driver assistance, autonomous driving, flying cars! Our solutions revolutionize quality control for the ICs that power the future of automotive.
5G Commentary
Semiconductor Engineering
The Growing Challenges of 5G Reliability
Semiconductor Engineering
Challenges Grow For 5G Packages And Modules
Orbotech blog
Brainstorm: how are manufacturers preparing for 5G
Orbotech blog
High-frequency 5G wireless infrastructure requires a new approach to PCB manufacturing
Orbotech blog
mSAP: The New PCB Manufacturing Imperative for 5G Smartphones