5G | KLA

5G generates new demand for semiconductor devices

Enhanced Mobile Broadband

Advanced semiconductor ICs with leading edge technologies, smaller design nodes and increased complexity are at the core of the mobile devices that serve the 5G network’s faster connections, higher data rates and enhanced capacity.

Ultra-Reliable Communications

The 5G network supports ultra-reliable, low latency communications for mission-critical applications such as autonomous driving, remote patient monitoring and smart power grids. High performance, high reliability electronics and semiconductor ICs maintain robust, uninterrupted data exchange.

Massive Networks

Long lasting, inexpensive but reliable sensors and innovative packaging architectures enable 5G’s massive machine-to-machine communications, connecting the low power devices that form the backbone of smart homes, smart cities, Industry 4.0 and IoT.

Integrated Circuit Quality

Semiconductor IC quality is fundamental to the success of mission-critical, low‐latency 5G services such as autonomous driving and security monitoring. High chip reliability and performance are achieved through implementation of comprehensive process control strategies across the semiconductor ecosystem.

IC Process Control

Packaging Inspection

Compound Semi Process Control

Semiconductor Manufacturing

5G applications are driving increased adoption of electronic devices that utilize RF power amplifiers and high-frequency filters, sensors and MEMS devices. Robust IC process technologies and process control strategies improve chip performance and reliability.

PVD, PECVD & Plasma Etch

Plasma Dicing

Packaging Advances

New IC packaging architectures with complex levels of integration—system in package (SiP) and fan-out on both wafer and panel—enable the development of 5G devices. Process technologies, including etch, PVD, CVD, and UV laser drilling support the formation of these complex packaging schemes. During packaging processing and after component formation, tighter quality requirements drive the need for accurate inspections at the wafer, die and sub-package levels.

Component Inspection

Wafer-Level Packaging (WLP) Inspection

Packaging Processing

High Density Interconnect PCB

5G-enabled devices require advanced printed circuit boards with finer linewidths, straight sidewall geometry and multiple layers with more stringent quality and reliability requirements. PCB inspection, repair and imaging systems help manufacturers find and repair defective layers and trace the source of defects, increasing the yield and reliability of finished PCBs.

PCB Inspection

PCB Repair

PCB Imaging