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Surface Measurement and Etch Depth Monitoring Tool

 P-17 stylus profiler  P-17
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Product Description

The P-17 stylus profiler offers industry leading surface measurement repeatability for reliable measurement performance.  The surface measurement tool has 200 mm scan length standard - the only stylus profiler on the market to offer long scan capability without the need for stitching.  The UltraLite® sensor includes dynamic force control, excellent linearity, and the highest vertical resolution making it the best sensor available on a  surface measurement tool.  The P-17 stylus profiler includes many features to enhance the user experience such as top and side view optics, etch depth monitoring. and motorized theta/leveling stages.  Finally, the surface measurement tool includes point-and-click operation and the productivity package to offer the easiest to use  surface measurement tool on the market with the features required by university, R&D, and production environments.

The P-17 OF (open frame) includes all of the capability of the P-17 stylus profiler with etch depth monitoring, but allows the user to load larger samples on the 9.5 by 9.5-inch square stage or 300 mm sample chuck.

Application

Semiconductors
CMP dishing, pattern-dependent erosion, surface topography characterization, and oxide planarity for greater device performance and yield loss reduction. Measures height, co-planarity and roughness of bumps for flip chip technology. Performs etch depth monitoring on open geometries with automated analysis and simple process set-ups.

Data Storage
Thin film head wafers and sliders, hard disks, optical and magnetic media. Wafer applications include plating thickness, coil heights, and CMP planarity. Slider applications include pole-tip recession analysis, air bearing cavities, and laser texture bump characterization that includes bump height, width, and etch depth monitoring.

MEMS and Opto-Electronics
MEMS and Opto-Electronics step heights, micro-lens height and curvature, and DWDM etch depth monitoring.

Other Applications
Hybrid circuits and ceramic substrates, paper and foil finishes, polished and machined surfaces, coated or painted surfaces, and precision-machined surfaces of any kind.

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