MicroXAM -1200 3D non-contact profilometer
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The MicroXAM-1200 3D non-contact profilometer is a surface characterization solution for a wide range of applications and industries - from R&D departments, universities, and commercial labs to production monitoring and process control in IC manufacturing and data storage. The MicroXAM - 1200 surface analysis solution is a non-contact profilometer which uses white light interferometry to generate high-resolution 3D images that provide the industry’s highest vertical resolution with excellent repeatability and precision, and superior reliability measurements. This surface analysis solution delivers automated data collection, automated analysis and reporting, with 2D or 3D advanced analysis suite to address a variety of application and reporting needs.
  • PSI (phase) and VSI mode (vertical) with patented noise suppression technology
  • 100 µm closed loop piezo stage and 10mm z-stage for VSI scanning mode
  • Sample stages up to 8” (200mm) with full stage travel
  • X-Y stage options supporting manual, motorized, and programmable 4, 6, and 8” (100, 150, and 200mm)
  • Sequence, Stitching, Thick film thickness, dissimilar materials, and masking measurement modules.
The precision engineered hardware along with powerful yet simple to use MapVUE® AE analysis software package offers the user a surface analysis solution with a number of parameter calculations, filtering options, imaging analysis and automated report generation to meet the most stringent R&D and production environment needs. MapVUE AE’s user interface offers simple recipe development, automated sequencing, and with a range of analysis tools. The flexibility of the instrument is further demonstrated with its mix of objectives and sample stages available to meet the need of each application with customization of the surface analysis solution.
Medical Devices
Surface texture, defect inspection, wear volume measurement and film thickness measurement of medical implants such as heart-valves, artificial joints, dental implants and stents.
Precision Machining
Wear on cylindrical surface, grain structure analysis, surface roughness characterization and form measurement
Data Storage
Substrate roughness monitoring, media roughness, waviness, laser texture, laser bump/scribe metrology, and disk roll-off height
Sapphire substrate roughness, waviness and edge roll-off; patterned sapphire bump height and width; defect characterization, and step height for photo resist and metallization
Semiconductors and Electronics
Wafer inspection including height of through silicon via and bond pads, height of deposition and etch steps film thickness, critical dimension measurement
Surface pattern and feature dimensions of holographic elements, micro-lens arrays, gem surface facet surface analysis and critical dimensioning, fiber optics connector end-face, etch performance and mask quality.
Shape, surface detail and defect features of MEMS sensors, actuators, deformable optics and pumps. Non contact process allows in situ measurement of activated structures.