Wafer Inspection and Metrology for Advanced Packaging

Wafer Inspection and Metrology for Advanced Packaging

KLA’s wafer inspection and metrology systems for advanced wafer-level packaging provide the data required for chip manufacturers to increase yield by providing traceability throughout their increasingly complex manufacturing processes. Smaller feature sizes, new integration schemes and the heterogeneous integration of multiple components into single packages result in tighter process control requirements. Our systems allow engineers to quickly detect, resolve and monitor excursions to provide greater control of quality for improved device performance.

CIRCL-AP

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CIRCL-AP

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System

CIRCL-AP is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer-level packaging (AWLP) process control. The CIRCL-AP tool is utilized for multiple AWLP applications requiring high sensitivity including 2.5D/3D integration, wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). With support for bonded, thinned and warped substrates, CIRCL-AP provides production-proven process control and monitoring strategies for Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL) and other packaging process flows.

Applications
Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor, Process tool qualification
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Kronos 1190

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Kronos 1190

Wafer-Level Packaging Inspection Systems

The Kronos 1190 patterned wafer inspection system with high resolution optics provides best in class sensitivity to critical defects for process development and production monitoring in advanced wafer-level packaging (AWLP) applications including 3D IC and high-density fan-out (HDFO). DefectWise integrates Artificial Intelligence (AI) as a system level solution, delivering a large boost in sensitivity, productivity and classification accuracy to address the challenges of overkill and defect escapes. DesignWise refines the FlexPoint precisely targeted inspection areas with direct design input to further reduce nuisance. Supporting bonded, thinned, warped and diced substrates, the Kronos 1190 system enables cost-effective defect inspection down to 150nm in critical process steps like post-dicing, pre-bonding, patterning of Cu pads, Cu pillars, bumps, through silicon vias (TSVs) and redistribution layers (RDL).

Applications
Defect discovery, Process debug, Process monitor, Tool monitor, Outgoing Quality Control (OQC)
Related Products

CIRCL-AP: The Kronos inspection technology is also available as a module on the CIRCL defect inspection, metrology and review cluster tool.

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WI-2280

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WI-2280

Multi-Substrate Defect Inspection and Metrology Systems

The WI-2280 automated optical inspection and metrology systems inspect and measure microelectronic devices on a variety of wafer substrates, supporting wafer-level packaging and post-dicing quality control for LED, VCSEL and other integrated circuit applications. It is capable of handling whole wafers from 2 to 8 inches and diced wafers on FFC or a hoop ring. With both inspection and 2D metrology capability, the WI-2280 systems provide feedback on the wafer surface quality; wafer dicing quality; and, critical dimension and overlay quality of bumps, pads and copper pillars. The systems are designed with IRIS (ICOS Review and Classification Software), which offers defect review and reclassification, for faster yield learning and improved process control.

Applications
Process monitor, Outgoing Quality Control (OQC), Tool monitor
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Zeta-5xx/6xx

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Zeta-5xx/6xx

Advanced Packaging Metrology Systems

The Zeta-5xx Series optical profilers are fully automated 300mm wafer metrology systems capable of measuring a variety of applications such as bump height, RDL (redistribution layer) CD, UBM (under bump metallization) step height, film thickness and wafer bow, which are critical to process control in advanced wafer-level packaging. Multi-mode optics save time and reduce cost by enabling a wide variety of measurement types on the single system, while the resulting high resolution 3D images and analysis provide the data required to enable process feedback cycles to drive yield improvement. For panel based wafer-level packaging applications, automated panel handling is available on the Zeta-6xx Series profilers, which offer the same metrology measurement capability as the 5xx Series.

Applications
Process monitor, Outgoing Quality Control (OQC), Tool monitor
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Klarity®

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Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications
Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction
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