Metrology

Metrology

KLA’s metrology systems address a range of chip and substrate manufacturing applications, including verification of design manufacturability, new process characterization and high volume manufacturing process monitoring. By providing precise measurement of pattern dimensions, film thicknesses, layer-to-layer alignment, pattern placement, surface topography and electro-optical properties, our comprehensive set of metrology systems allows chip manufacturers to maintain tight control of their processes for improved device performance and yield.

Archer™

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Archer™

Overlay Metrology Systems

The Archer™ 750 overlay metrology system provides accurate feedback of on-product overlay error for fast technology ramps and stable production of leading-edge memory and logic devices. Wavelength tunability with 10nm resolution delivers accurate and robust overlay error measurements in the presence of production process variations. With productivity levels typically only seen with scatterometry-based systems, the Archer 750 imaging-based overlay system supports increased sampling for high order scanner corrections and high throughput for inline monitoring. Advanced algorithms and a novel rAIM™ overlay target design produce improved correlation between target and device overlay errors, helping lithographers accurately track device overlay performance.

Applications

On-product overlay control, Inline monitoring, Scanner qualification, Patterning control

Related Products

Archer 700: Imaging-based overlay metrology system with a tunable light source for accurate and process robust overlay error measurement of ≤7nm logic and advanced memory design nodes.

Archer 600: Imaging-based overlay metrology system for advanced memory and ≤10nm logic devices.

Archer 500LCM: Dual imaging- and scatterometry-based overlay measurement modules for a range of process layers at the 2Xnm/1Xnm design nodes.

Archer 500: Imaging-based overlay metrology system for 2Xnm/1Xnm design nodes.

ATL: Scatterometry-based overlay metrology system for ≤7nm logic and advanced memory design nodes.

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ATL™

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ATL™

Overlay Metrology Systems

The ATL100™ (Accurate Tunable Laser) scatterometry-based overlay metrology system provides overlay control for development and high volume manufacturing at ≤7nm design nodes. Tunable laser technology with 1nm resolution paired with real-time Homing™ maintains high overlay accuracy in the presence of production process variations. The ATL100 supports a diverse range of scatterometry overlay measurement target designs, including in-die and small pitch, enabling accurate overlay error measurement for different process layers, device types, design nodes and patterning technologies.

Applications

On-product overlay control, Inline monitoring, Scanner qualification, Patterning control, In-die measurements

Related Products

Archer: Imaging-based overlay metrology systems that provide high accuracy overlay measurements for development and high volume manufacturing at the ≤1Xnm design nodes.

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SpectraShape

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SpectraShape

Optical Critical Dimension (CD) and Shape Metrology Systems

The SpectraShape™ 11k dimensional metrology system is used to fully characterize and monitor the critical dimensions (CD) and three dimensional shapes of finFETs, vertically stacked NAND and DRAM structures, and other complex features on integrated circuits at leading-edge design nodes. Using significant advancements in optical technologies and patented algorithms, the SpectraShape 11k identifies subtle variations in critical device parameters (critical dimension, high k and metal gate recess, side wall angle, resist height, hardmask height, pitch walking) across a range of process layers. With an improved stage and new measurement modules that enable high throughput operation, the SpectraShape 11k provides fast identification of process issues inline, helping fabs accelerate yield ramps and achieve stable production.

Applications

Inline process monitor, Patterning control, Process window expansion, Process window control, Advanced Process Control (APC), Engineering analysis

Related Products

AcuShape®: Advanced modeling software that interprets the signals from SpectraShape systems, helping to accelerate the process of building robust, usable 3D shape models.

SpectraShape 10K: Optical CD and shape metrology systems enabling measurement of complex features for 1Xnm logic and advanced memory IC devices.

SpectraShape 9000: Optical CD and shape metrology systems enabling measurement of complex features for IC devices at the 20nm and below design nodes.

SpectraShape 8810/8660: Optical CD measurement and shape measurement systems enabling process monitoring of key structural parameters for IC devices at the 32nm and below design nodes.

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SpectraFilm

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SpectraFilm

Film Metrology Systems

The SpectraFilm™ F1 film metrology system helps achieve strict process tolerances at sub-7nm logic and leading-edge memory design nodes by providing high-precision thin film measurements for a broad range of film layers. The high brightness light source drives the spectroscopic ellipsometry technology which provides the signal required to accurately measure the bandgap and provide insight into electrical performance weeks earlier than e-test. New FoG™ (Films on Grating) algorithms further increase the measurement’s correlation to device by enabling film measurement on a device-like grating structure. With increased throughput, SpectraFilm F1 offers high productivity, supporting the increased number of film layers associated with leading-edge device fabrication techniques.

Applications

Bandgap monitoring, Engineering analysis, Inline process monitor, Tool monitor, Process tool matching

Related Products

SpectraFilm LD10: The SpectraFilm™ LD10 film metrology system provides reliable, high-precision measurements of thin and thick film thickness, refractive index and stress for a broad range of film layers at the 16nm design node and beyond.

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Aleris®

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Aleris®

Film Metrology Systems

The Aleris® film metrology systems provide reliable and precise measurement of film thickness, refractive index, stress and composition for the 32nm node and beyond. Utilizing Broadband Spectroscopic Ellipsometry (BBSE) technology, the Aleris film metrology systems form a comprehensive film thickness measurements and metrology solution, helping fabs to qualify and monitor a broad range of film layers.

Aleris 8330
The Aleris 8330 film metrology system is a low cost-of-ownership solution for non-critical films, including inter-metal dielectrics, photoresists, bottom anti-reflective coatings, thick oxides and nitrides, and back end of line layers.

Aleris 8350
The Aleris 8350 is a high-performance film metrology system that meets the tighter process tolerances required for thickness, refractive index and stress measurements on critical films. The Aleris 8350 film thickness measurement system is used for advanced film development, characterization and process control for a wide range of critical films, including ultra-thin diffusion layers, ultra-thin gate oxides, advanced photoresists, 193nm ARC layers, ultra-thin multi-layer stacks, and CVD layers.

Aleris 8510
The Aleris 8510 extends the Aleris Family’s film thickness measurements, composition, and stress measurement capability to advanced high k metal gate (HKMG) and ultra-thin decoupled plasma nitridation (DPN) process layers. Utilizing enhanced 150nm Broadband Spectroscopic Ellipsometry technology, the Aleris 8510 film thickness measurement system provides engineers with the film metrology data required for development and inline monitoring of DPN layers and all HKMG layers – from gate through poly, including Hf and N dose and film thickness measurements.

Applications

Engineering analysis, Inline process monitor, Tool monitor, Process tool matching

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PWG™

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PWG™

Patterned Wafer Geometry (PWG) Metrology Systems

The PWG™ patterned wafer geometry metrology platform produces comprehensive wafer flatness, dual-sided nanotopography and high-resolution edge roll-off data for IC manufacturers. The PWG3™ patterned wafer geometry measurement system for advanced 3D NAND, DRAM and logic manufacturers is a single-tool solution for measuring stress-induced wafer shape, wafer shape-induced pattern overlay errors, wafer thickness variations and wafer front- and backside topography. Its data is used for inline monitoring of fab processes, overlay corrections and scanner focus control, enabling improved patterning and faster yield ramp.

Applications

Process monitoring, Inline monitoring, Lithography control

Related Products

PWG2™: Second-generation patterned wafer geometry measurement system, supporting inline monitoring of fab-wide processes for a range of memory and logic device types.

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Therma-Probe®

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Therma-Probe®

Implant Metrology Systems

The Therma-Probe® 680XP ion implant/anneal metrology system enables inline dose monitoring for the 2Xnm/1Xnm design nodes. The Therma-Probe 680XP produces critical process information about ion implant dose and profile, implant and anneal uniformity and end of range damage. In addition, the Therma-Probe 680XP system’s high resolution micro uniformity maps provide fingerprinting capability for implant and anneal process development.

Applications

Process monitor, Tool monitor

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OmniMap® RS-200

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OmniMap® RS-200

Sheet Resistance Measurement Systems

The OmniMap® RS-200 resistivity mapping system, based on proven industry resistivity mapping standards, provides accurate and reliable sheet resistance measurement for 45nm and beyond. This resistivity mapping system provides capabilities such as advanced automation and improved edge performance to meet today's 300mm wafer production requirements.

Applications

Process monitor, Tool monitor

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CIRCL™

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CIRCL™

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System

The CIRCL™ cluster tool has four modules, covering all wafer surfaces and providing parallel data collection at high throughput for efficient process control. The modules comprising the latest-generation CIRCL5 system include: front side wafer defect inspection; wafer edge defect inspection, profile, metrology and review; backside wafer defect inspection and review; and, optical review and classification of front side defects. Data collection is controlled by DirectedSampling™, an innovative approach that uses results from one measurement to trigger other types of measurements within the cluster. The modular configuration of CIRCL5 offers flexibility for varying process control needs, saves overall fab space, reduces wafer queue time, and provides a cost-effective upgrade path to protect a fab's capital investment.

Applications

Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor

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Surfscan®

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Surfscan®

Unpatterned Wafer Defect Inspection Systems

The Surfscan® SP7 unpatterned wafer inspection system supports leading-edge logic and memory design nodes through qualification of: processes, materials and tools, including those for EUV lithography, for IC manufacturing; advanced substrates, such as prime silicon, epitaxial, and SOI wafers, for substrate manufacturing; and process tool performance for equipment manufacturing. Using a DUV laser source with peak power control, a novel optical architecture, a range of spot sizes and advanced algorithms, the Surfscan SP7 delivers ultimate sensitivity and enhanced defect classification at high throughput for bare wafers, smooth and rough films, and fragile resists and litho stacks. The Surfscan SP7 also integrates a high resolution SURFmonitor™ module that characterizes surface quality and detects subtle defects, helping qualify processes and tools.

Applications

Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, EUV resist and scanner qualification, Process debug

Related Products

Surfscan SP5XP: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 1Xnm design nodes.

Surfscan SP5: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2X/1Xnm design nodes.

Surfscan SP3: Unpatterned wafer inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2Xnm design node.

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Profiler Portfolio

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Profiler Portfolio

Optical and Stylus Profilers

KLA offers a range of stylus and optical profilers that support surface metrology measurements for semiconductor IC, power device, LED, photonics, MEMS, CPV solar, HDD and display manufacturing. Please visit our profilers site for more details.

Applications

Step height, Roughness, Flatness, Curvature, Stress, Film thickness, Defect review, and more…

Related Products

P-17

P-170

HRP®-260

MicroXAM-800

Zeta-20

Zeta-300

Zeta-388

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