IC Component Inspection and Metrology

IC Component Inspection and Metrology

KLA’s packaged component inspection and metrology systems characterize key features of advanced and traditional package types with varying size and interconnect styles. Our systems provide sensitivity to a variety of defect types as well as accurate and repeatable 3D metrology measurements, which together provide packaging manufacturers the data required to improve their yield while effectively sorting components so that defective parts are quickly removed. By providing flexible systems capable of handling a large variety of package types, engineers can further increase overall operational effectiveness in a dynamic manufacturing environment.

ICOS T3/T7

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ICOS T3/T7

Packaged IC Inspection and Metrology Systems

The ICOS T3/T7 Series delivers multiple options for fully automated optical inspection of packaged integrated circuit (IC) components with tray (T3) or tape (T7) output. The ICOS T3/T7 Series provides increased sensitivity to small defect types paired with accurate and repeatable 3D metrology measurements to provide enhanced detection of issues that affect final package quality. For the most accurate component sorting process, the ICOS T3/T7 Series utilizes Artificial Intelligence (AI) systems with deep learning algorithms to enable smart and agile binning of defect types. The ICOS T3 and T7 inspectors share a common platform, enabling reconfiguration from tray to tape output for optimal tool use in a changing environment.

Applications
Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)
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ICOS T890

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ICOS T890

Packaged IC Inspection and Metrology Systems

The ICOS T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components. It leverages high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. The ICOS T890 offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.

Applications
Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)
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ICOS MV996L

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ICOS MV996L

Packaged IC Inspection and Metrology Systems

The MV996L component inspector provides fully automated optical inspection of packaged integrated circuit (IC) components with tray output. The MV996L system delivers on the fly (OTF) inspection with the 2D and 3D measurement sensitivity required for accurate detection of final package quality issues. Multiple row pickup enables the throughput needed for volume manufacturing, while a simple conversion process for changing between packages provides an efficient solution for quality control for a range of package sizes and types.

Applications
Component Outgoing Quality Control (OQC) for Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Thin Small Outline Package (TSOP), Quad Flat No Leads package (QFN) and customized packages
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ICOS MV925L

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ICOS MV925L

Packaged IC Inspection and Metrology Systems

The MV925L component inspector provides fully automated optical inspection of packaged integrated circuit (IC) components with dual tape or tray output. The MV925L system delivers multiple row on the fly (OTF) inspection for tray to tray or single row pick up to tape resulting in a flexible setup for low cost of ownership for a changing production environment. With 2D and 3D measurement sensitivity, the MV925L inspector enables accurate detection of final package quality issues. A simple conversion process provides an efficient solution for a range of package sizes and types.

Applications
Component Outgoing Quality Control (OQC) for Ball Grid Array (BGA), Quad Flat Package (QFP), Chip Scale Package (CSP), Thin Small Outline Package (TSOP), Quad Flat No Leads package (QFN) and customized packages
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ICOS MV998L

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ICOS MV998L

Packaged IC Inspection and Metrology Systems for QA

The MV998L component inspector provides portable optical inspection of packaged integrated circuit (IC) components for quality assurance (QA) testing with tray output. Focused on delivering a mobile solution, the MV998L system provides 2D and 3D measurement sensitivity for improved detection of quality issues on leads, balls and pads in a changing manufacturing environment. Zero package conversions are required to switch between standard package types, ensuring the MV998L inspector maintains flexibility and saves time during the QA process.

Applications
Quality assurance (QA) for Ball Grid Array (BGA), Quad Flat Package (QFP), Thin Small Outline Package (TSOP), Quad Flat No Leads package (QFN) and customized packages
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Klarity®

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Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications
Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction
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