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In Situ Process Management

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In Situ Process Management

KLA-Tencor’s comprehensive portfolio of SensArray® products enables in situ monitoring of process tools’ environments. With wired and wireless sensor wafers and reticles, an automation package and data analysis systems, SensArray® products provide comprehensive information for a wide range of wafer and reticle processes. Wafer process equipment manufacturers, IC manufacturers and reticle manufacturers use SensArray® data to visualize, diagnose and control process conditions.

Download the SensArray® Product Line Overview to learn more.

Categories

EtchTemp Series

Overview of the WetTemp-LP monitor wafer showing thickness

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EtchTemp Series

In Situ Plasma Etch Wafer Temperature Measurement Systems

The EtchTemp Series of in situ wafer temperature measurement systems captures the effect of the plasma etch process environment on production wafers. The EtchTemp-SE measurement system includes a protective coating, enabling temperature monitoring during silicon plasma etch processes. By characterizing thermal conditions that closely represent product wafer conditions, the EtchTemp-SE wireless wafer assists process engineers with tuning of the etch process conditions, and the qualification, matching and post-PM verification of front end of line plasma etch chambers.

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Chamber matching, Process tool matching

Dielectric plasma etch (EtchTemp), Conductor plasma etch (EtchTemp-SE), Ion implant | 20-140°C

Related Products

EtchTemp: Temporal and spatial temperature data under real process conditions for characterization of high-power, high-frequency dielectric etch wafer processes.

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SensArray® Automation

Close up of In Situ Temperature Measurement Automation Package

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SensArray® Automation

In Situ Temperature Measurement Automation Package

The SensArray® Automation package provides fast automated collection of process tool chamber temperature measurements. The package includes an overhead track (OHT) compatible FOUP, automation station, system automation controller and office PC software seat components. SensArray FOUPs can be processed the same way as any production FOUP, with direct data porting to SPC charts. SensArray Automation provides productivity enhancements resulting from gains in process tool availability, more efficient use of engineering resources and centralized data storage in the fab’s MES database.

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Chamber matching, Process tool matching

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HighTemp-400

Overview of the HighTemp-400 wireless wafer

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HighTemp-400

In Situ Film Deposition Wafer Temperature Measurement System

The HighTemp-400 in situ wafer temperature measurement system is designed to optimize and monitor advanced film processes (FEOL and BEOL ALD, CVD and PVD) and other elevated temperature processes. The HighTemp-400 wireless wafer measures process tool thermal uniformity, providing temporal and spatial temperature data collected under real production process conditions. By revealing thermal variations that can affect process windows and patterning performance, the HighTemp-400 helps IC manufacturers with the integration of new materials, transistor technologies and complex patterning techniques.

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching

Thin film deposition | 20-400°C

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UV Wafer

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UV Wafer

In Situ Deposition and Anneal UV Light Measurement System

The UV Wafer in situ ultraviolet (UV) light measurement system utilizes wireless sensor wafer technology to measure UV light dosage and intensity at the wafer surface within film deposition process tools. Enabling previously unavailable process optimization and monitoring, the UV Wafer provides temporal and spatial information on the intensity of light reaching the wafer surface from the UV lamp used to anneal or cure FCVD (flowable) oxides and low k dielectric films. The UV Wafer can also identify lamp age-induced drift or other changes in the lamp intensity that result in non-uniform film properties. By highlighting optics system issues within the UV lamp subsystem, the UV Wafer helps engineers drive process tool improvements that result in optimal curing processes.

Applications

Process development, Process qualification, Process tool qualification, Process tool monitoring, Process tool matching

Film deposition, UV curing, UV anneal

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MaskTemp 2

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MaskTemp 2

In Situ Reticle Temperature Measurement System

The MaskTemp 2 in situ reticle temperature measurement system is used by mask shops for qualification and monitoring of e-beam writers and high temperature reticle process steps. The MaskTemp 2 serves a key role in the qualification of e-beam mask writers as extreme temperature stability is required over the extended time period (up to 24 hours) required to completely write a mask. Inside the e-beam mask writer, the MaskTemp 2 collects temperature data for 24 consecutive hours, providing mask manufacturers with the data needed to ensure the thermal stability of the system prior to writing critical masks. The Mask Temp 2 also supports post-exposure bake characterization, hot plate temperature uniformity monitoring, hot plate matching, and other high temperature process applications, helping mask manufacturers identify and reduce post-write process thermal variations that affect final reticle quality.

Applications

e-Beam mask writer qualification, Process development, Process control, Process qualification, Process monitoring, Process tool qualification, Process tool matching

e-Beam mask write | 20-40°C
Post-exposure bake | 20-140°C

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ScannerTemp

Overview of the WetTemp-LP monitor wafer showing thickness

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ScannerTemp

In Situ Scanner Wafer Temperature Measurement System

The ScannerTemp in situ wafer temperature measurement system supports monitoring of dry, immersion and EUV lithography scanners. The ScannerTemp wireless wafer produces high accuracy temporal and spatial wafer temperature data that can help lithography engineers characterize and monitor scanner thermal variations that affect pattern overlay performance. With a flat, standard-thickness wafer format, ScannerTemp can be used to monitor lithography thermal uniformity and stability with high precision and low noise, enabling scanner qualification and matching.

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching

Lithography scanners | 20-24°C

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Integrated Wafer™

Overview of the Integrated Wafer™ in situ wafer

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Integrated Wafer™

In Situ Lithography Wafer Temperature Measurement System

The Integrated Wafer™ in situ wafer temperature measurement system gathers critical thermal data for monitoring and maintaining lithography processes. With a wireless, low profile design, the Integrated Wafer can be used with almost all lithography process equipment, providing high accuracy static and dynamic temperature measurements for critical production processes. The Integrated Wafer helps lithography engineers characterize thermal dose uniformity and analyze segments of the thermal cycle, including transport, heating, cooling and steady state operations. Integrated Wafer supports applications such as measurement and monitoring of critical hot plate heating zone elements in advanced lithography processes (e.g., track post-exposure bake stations).

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching

Lithography track post-exposure bake | 15-145°C

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WetTemp-LP

Overview of the WetTemp-LP monitor wafer showing thickness

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WetTemp-LP

In Situ Wet Processing Wafer Temperature Measurement System

The WetTemp-LP in situ wafer temperature measurement system supports monitoring of wet clean and other wet processes. The WetTemp-LP monitor wafer is the same thickness as a standard product wafer, ensuring compatibility with most single wafer and batch wet clean process systems. With multiple integrated temperature sensors, the WetTemp-LP provides rich spatial temperature data that helps engineers qualify new wet clean tools, optimize wet clean processes and drive improvements in wet clean system performance.

Applications

Process development, Process qualification, Process tool monitoring, Process tool qualification, Process tool matching

Wet etch, wet clean | 15-140°C

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Process Probe™ 1530/1535

Overview of the Process Probe™ 1535 instrumented wafer

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Process Probe™ 1530/1535

In Situ Wafer Temperature Monitoring System

The Process Probe™ 1530 and 1535 instrumented wafers are used to monitor in situ temperatures for a wide range of processes, including cold wall, RTP, sputtering, CVD, plasma strippers and epitaxial reactors. The Process Probe 1530 and 1535 provide direct, real-time measurement of wafer temperature during each critical step of the process cycle. With this comprehensive temperature data, process engineers can characterize and fine tune process conditions, driving improved process equipment performance, wafer quality and yield.

Applications

Process development, Process qualification, Process tool qualification, Process tool matching

Cold wall thin film process chambers (1530), Hot wall thin film process chambers (1535) | 0-1100°C

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Process Probe™ 1630

Overview of the Process Probe™ 1630 instrumented wafer

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Process Probe™ 1630

In Situ Wafer Temperature Monitoring System

The Process Probe™ 1630 instrumented wafers enable precise in situ characterization of wafer temperature profiles for front end atmospheric and belt CVD systems and back end wafer solder bumping reflow ovens. With the Process Probe 1630, process engineers can determine edge-to-center temperature profiles to adjust heater zone set points, and measure drift in deposition temperature to adjust for heat transfer changes from oxide build-up on the heaters and belts.

Applications

Process development, Process qualification, Process tool qualification, Process tool matching

Thin film APCVD, Solder bump reflow ovens | 0-800°C

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Process Probe™ 1730

Overview of the Process Probe™ 1730 instrumented wafer

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Process Probe™ 1730

In Situ Wafer Temperature Monitoring System

The Process Probe™ 1730 instrumented wafers enable precise in situ characterization of wafer temperature profiles in photoresist track systems, temperature controlled wafer chuck systems, oven applications, and resist bake, polyimide, and SOG applications. The Process Probe 1730 helps engineers characterize and fine tune process conditions to improve process equipment performance for higher yield.

Applications

Process development, Process qualification, Process tool qualification, Process tool matching

Lithography track systems, Temperature controlled wafer chuck systems and ovens | -150-300°C

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Process Probe™ 1840/1850

Overview of the Process Probe™ 1840 instrumented wafer

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Process Probe™ 1840/1850

In Situ Wafer Temperature Monitoring System

The Process Probe™ 1840 and 1850 instrumented wafers provide high accuracy, real-time hot plate temperature measurements, supporting processes such as photoresist track systems and wafer probers. The Process Probe 1840 and 1850 allow direct measurement of wafer temperature stability and uniformity without dependence on imprecise process monitors or contact temperature sensors. With the Process Probe 1840 and 1850, lithography engineers can characterize and fine tune the photoresist bake temperature uniformity, ensuring that advanced lithography processes meet the temperature accuracy required for achieving high yield.

Applications

Process development, Process qualification, Process tool qualification, Process tool matching

Lithography track post-exposure bake, Spin-on anti-reflective coatings, Back end probers | 0-250°C (1840), 0-350°C (1850)

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PlasmaSuite

PlasmaSuite program screenshot

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PlasmaSuite

Plasma Data Analytics System

PlasmaView
The PlasmaView process analysis viewing system provides an intuitive interface for viewing detailed plasma etch process analyses. Using data collected from EtchTemp and EtchTemp-SE. PlasmaView displays the plasma process data versus time and space (2D or 3D). Movie view allows process engineers to visualize critical transient responses, which can be used for fault investigations.


PlasmaControl
The PlasmaControl analysis engine helps monitor and control day-to-day operations and chamber-to-chamber matching. It distills complicated plasma etch processes down to a few critical components and compares them to control specifications, providing a simple ‘Go’ or ‘No Go’ result for each run. PlasmaControl provides engineers with the ability to view trends, detect and investigate excursions, and compare plasma etch process chambers.

Applications

Process development, Process control, Process analysis, Troubleshooting

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LithoSuite

Graphs showing Baseline and AutoCal results

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LithoSuite

Lithography Data Analytics System

LithoView
The LithoView process analysis user interface provides standardized data viewing capability, including 2D and 3D temporal views of data. LithoView provides engineers with full mission control capability, such as full SensorWafer™ communications, mission operations and data downloading. LithoView also includes a database and browser for complete tracking of data history.


AutoCal TrackTune Application
The AutoCal TrackTune advanced software application is used for calibrating and optimizing advanced track hotplates. The application leverages the accuracy of the data collected with the SensArray® Integrated Wafer to capture the temperature profile of the photoresist processing zone. By combining detailed thermal profile data with an OEM plate-specific thermal modeling engine, it generates optimized hotplate control system input parameter settings. These optimized settings dramatically improve within plate uniformity and synchronize plate-to-plate thermal profiles.

Applications

Process data analytics

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Thermal MAP®

Wireless ISIS 5 and computer showing Thermal MAP® software.

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Thermal MAP®

Wireless Data Acquisition and Data Analytics

The Thermal MAP® data acquisition and analysis system supports in situ wafer temperature measurements. The Thermal MAP system combines the wireless ISIS 5 (Intelligent Sensor Interface System) data acquisition unit with powerful, graphical software for visualization and analysis of data collected by any SensArray® instrumented wafer. This sophisticated wafer temperature data acquisition and analysis system provides outstanding accuracy, precision and resolution for both transient and steady-state measurements. By delivering concise, informative graphic representations of temperature ramp-up, steady state and ramp-down, Thermal MAP supports rapid process optimization with the following tools:

  • Contour and surface maps to aid correlation to film thickness and resistivity maps
  • Animations for rapid viewing of temperature profile changes during the process
  • Run-to-run and within-run analyses

Applications

Process data analytics

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