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At the Advanced Packaging & System Integration Technology Symposium, packaging experts from all over the world will come to exchange ideas on their vision and future perspectives on topics including: panel level, fan out, system in package, advanced substrates and 3D technology.

KLA-Tencor’s Stephen Hiebert will present “Defect Inspection for Shrinking RDL Line/Space in High-Density Fan-Out Wafer Level Packaging.”
Event Dates Wednesday, June 20, 2018
Thursday, June 21, 2018
Location Hotel Nikko Wuxi, Wuxi, China

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