IC Substrate Production Processes

IC Substrate Production Processes

Based on decades of experience, Orbotech's portfolio of technologies for IC substrates includes a variety of direct imaging (DI), automated optical inspection (AOI), automated optical shaping (AOS) of defects, UV laser drilling, inkjet/additive printing and software solutions. Orbotech's advanced solutions for IC substrates enable manufacturers to build high capacity, high quality, high precision interconnection products for advanced IC packaging while optimizing their productivity and cost-efficiency.

Paragon Ultra

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Paragon Ultra

Direct Imaging Systems

Orbotech's field-proven Paragon™ Ultra direct imaging (DI) family of solutions is designed specifically to handle the most challenging flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP), ball grid array/chip scale package (BGA/CSP) and module applications, enabling manufacturers to achieve higher yields and lower their total cost of ownership (TCO). The Paragon Ultra solutions deliver unmatched results driven by Orbotech's unique technologies, including fine line imaging down to 8µm, high throughput and superior registration accuracy. These field proven systems support the semi-additive process (SAP), modified semi-additive processes (mSAP) and other innovative substrate processes.

Applications

Fine line direct imaging of etch-resist and plate-resist flip-chip ball grid array (FCBGA), flip-chip chip scale package (FCCSP), ball grid array/chip scale package (BGA/CSP)

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Ultra Dimension 900

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Ultra Dimension 900

Automated Optical Inspection (AOI) Systems

Designed to meet the demanding, high precision requirements of AOI for IC substrate manufacturing, Orbotech's Ultra Dimension™ 900 automated optical inspection solution leverages field-proven inspection and measurement capabilities to deliver superior laser via (LV) inspection accuracy and operational efficiency with ultra fine pattern inspection down to 5μm. The solution provides manufacturers of advanced PCB processes with the flexibility to inspect a variety of applications and materials. Driven by unique proprietary technologies, the Ultra Dimension 900 system is able to integrate images from three channels into a single multicolor image enabling operators to accurately differentiate between real and false defects in under one second.

Applications

Fine pattern inspection of flip-chip ball grid array (FCBGA) and flip-chip chip scale package (FCCSP) IC substrates

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Ultra PerFix

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Ultra PerFix

Automated Optical Shaping (AOS) Systems

Orbotech's Ultra PerFix™ range of automated optical shaping (AOS) solutions deliver the highest quality shaping of short defects in the most advanced IC substrate boards. By accurately shaping complex or fine defects on panels that might otherwise have been scrapped, the Ultra PerFix solutions enable IC substrate manufacturers to dramatically increase their yield and reduce their scrap, ensuring high quality boards at high volumes. The Ultra PerFix family offers an easy-to-operate, fully automated process with high throughput that delivers significant savings on manpower with a low total cost of ownership (TCO).

Applications

Automated optical shaping of short defects in flip-chip ball grid array (FCBGA) and flip-chip chip scale package (FCCSP) IC substrates

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Emerald 160F

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Emerald 160F

UV Laser Drilling Systems

Orbotech's Emerald™ 160F solution represents a new level of advanced UV laser drilling capabilities for today’s most challenging IC substrate applications, delivering maximum performance and production yield. With its excellent beam quality, fine via size down to 20µm diameter and superior accuracy down to 6μm, the Emerald 160F system is specifically designed for advanced IC substrate applications such as flip-chip ball grid array (FCBGA). Orbotech's Emerald 160F system is optimized to support advanced packaging applications like organic interposers and embedded die as well as low temperature co-fired ceramic (LTCC).

Applications

UV laser drilling of blind vias (BV) and through hole vias (THV) in flip-chip ball grid array (FCBGA) substrates, embedded dies and low temperature co-fired ceramic (LTCC)

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Orbotech Magna and Orbotech Jetext

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Orbotech Magna and Orbotech Jetext

Inkjet/Additive Printing Systems

Orbotech’s inkjet and additive printing solutions for IC substrates deliver high quality, high accuracy and high productivity printing at a low total cost of ownership (TCO).

The Orbotech Magna™ additive printing solution is designed to print dams for flip-chip chip scale package (FCCSP), ball grid array (BGA), and advanced system in package (SiP) modules, enabling manufacturers to save space and costs when preventing underfill leakage by depositing a protective barrier to seal off the surrounding die area. The Orbotech Magna solution also enables selective insulation layer printing such as routable quad flat no-lead package (QFN), IC substrates and more. This eliminates expensive lithography steps, simplifies the conventional process and reduces operational costs, enabling a faster ramp-up and time to market for new products.

The Orbotech Jetext™ inkjet printing solution offers a safe and smart CAM-ready (computer aided manufacturing) alternative for legend and 2D barcode package marking that eliminates the risk of damage from heat or contact. It delivers precise and uniform material deposition on the most challenging uneven surfaces with accurate pattern alignment and high speed, high contrast, fine-feature printing.

Applications

Orbotech Magna: Advanced printing for flip-chip chip scale package (FCCSP), ball grid array (BGA) and advanced system-in-package (SiP) modules as well as selective insulation layer printing e.g. routable quad flat no-lead package (QFN), IC substrates and more

Orbotech Jetext: Legend and 2D barcode package marking

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