Die Sorting and Inspection
Die Sorting and Inspection
KLA’s die sorting and inspection system provides inspection before die assembly to help engineers quickly identify any issues during the dicing process of wafer-level packages. The evolution of wafer-level packaging technologies has introduced new materials into the process that can be susceptible to cracking during dicing such as low k materials in fan-in wafer-level packages. Our system assists chip manufacturers to decrease production risk by identifying defects quickly during die sorting to ensure higher outgoing quality to the next step in the assembly process.
ICOS™ F160XP
Die Sorting and Inspection Systems
The ICOS™ F160XP die sorting and inspection system provides high performance die sorting with integrated, fully automated inspection of diced wafer-level packages. The ICOS F160XP system includes the new IR2.0 inspection module, which provides reliable detection of invisible laser groove, hairline and sidewall cracks, all of which are killer defects for advanced fan-in wafer-level packages, memory and bare dies. The IR2.0 module combines optical and IR side inspection to provide an efficient inspection flow with high sensitivity to multiple defect types for maximum die sorting accuracy. The ICOS F160XP system is highly flexible and supports many workflows, including wafer-to-tape and tape-to-tape. Its fast conversions between different configurations, dual station flipper, automatic calibrations and precision die pickup enhance tool value in high volume manufacturing environments.
Applications
Die sorting, Outgoing Quality Control (OQC), Known Good Die (KGD), Unit Level Traceability (ULT)