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Packaging Manufacturing

Zoomed in image of microchip

Packaging Manufacturing

KLA-Tencor’s packaging portfolio offers systems for package inspection, metrology, die sorting and data analytics to help outsourced semiconductor assembly and test (OSAT) providers, device manufacturers and foundries meet standards and increase yield in advanced packaging processes. Innovations in advanced wafer-level semiconductor packaging processes, such as 2.5D/3D IC integration using through silicon vias (TSVs), wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP), bring new and evolving process requirements. KLA-Tencor’s packaging portfolio provides the process control and outgoing quality accuracy required to accelerate manufacturing, while providing the flexibility for handling the wide variety of packaging applications.

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ICOS F160

IC Component Inspection System with circuits

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ICOS F160

Die Sorting and Inspection Systems

The ICOS F160 die sorting and inspection system provides high performance die sorting with integrated, fully automated inspection of diced wafer-level packages. The ICOS F160 system includes the xSide™+ IR inspection module, which provides robust detection of invisible laser groove, hairline and sidewall cracks, all of which are killer defects for advanced fan-in wafer-level packages, memory and bare dies. The ICOS F160 die sorter also supports 6-side optical inspection and includes pre- and post-placement inspection for maximum die sorting accuracy. The ICOS F160 system is highly flexible and supports many workflows, including wafer-to-tape and tape-to-tape. Its fast conversions between different configurations, automatic calibrations and precision die pickup facilitate increased tool utilization in high volume manufacturing environments.

Applications

Die sorting, Outgoing Quality Control (OQC), Known Good Die (KGD), Unit Level Traceability (ULT)

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ICOS T3/T7

IC Component Inspection System with circuits

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ICOS T3/T7

Packaged IC Inspection and Metrology Systems

The ICOS T3 Series provides high performance, fully automated optical inspection of packaged integrated circuit (IC) components with tray output. The ICOS T3 Series incorporates the SPECTRUM+ and SIGMA modules, producing increased 2D and 3D measurement sensitivity for improved detection of issues that affect final package quality. With its highly flexible design, the ICOS T3 supports a wide range of inspection requirements – with base configurations that minimize cost of ownership and advanced models that support more complex package quality determination requirements. The ICOS T3 Series shares a common platform with the ICOS T7 Series, enabling reconfiguration from tray to tape output for optimal tool use in a changing environment.

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Applications

Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)

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ICOS T890

ICOS® T890 component inspector with multiple IC components

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ICOS T890

Packaged IC Inspection and Metrology Systems

The ICOS T890 component inspector provides high-performance, fully automated optical inspection of packaged integrated circuit (IC) components. It leverages high sensitivity with 2D and 3D measurements to determine final package quality for a wide range of device types and sizes. The ICOS T890 offers parallel operation of four independent inspection stations and a component sorting station, achieving high throughput, cost-effective component inspection.

Learn more by downloading our PDF brochure.

Applications

Component Outgoing Quality Control (OQC) for all package types (Thin Quad Flat Package (TQFP), Quad Flat Package (QFP), BGA, Chip Scale Package (CSP), Wafer-Level Package (WLP), QFN, Bump Chip Carrier (BCC), Land Grid Array (LGA), and more…)

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CIRCL™-AP

CIRCL™-AP cluster tool inspecting a wafer

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CIRCL™-AP

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System

CIRCL™-AP is a cluster tool with multiple modules, covering all-surface inspection, metrology and review at high throughput for efficient advanced wafer-level packaging (AWLP) process control. The CIRCL-AP tool is utilized for multiple AWLP applications requiring high sensitivity including 2.5D/3D integration, wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). With support for bonded, thinned and warped substrates, CIRCL-AP provides production-proven process control and monitoring strategies for Cu-pillars, bumps, through silicon vias (TSVs), redistribution layer (RDL) and other packaging process flows.

Applications

Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor, Process tool qualification

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Kronos™ 1080

Kronos™ 1080 inspecting a patterned wafer

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Kronos™ 1080

Wafer-Level Packaging Inspection Systems

The Kronos™ 1080 patterned wafer inspection system provides high sensitivity to critical defects for advanced wafer-level packaging (AWLP) production monitoring. Supporting bonded, thinned and warped substrates, the Kronos 1080 system enables cost-effective defect inspection for multiple AWLP applications including 2.5D/3D integration, wafer-level chip scale packaging (WLCSP) and fan-out wafer-level packaging (FOWLP). The Kronos 1080 inspectors feature multi-mode scanning technology, FlexPoint™ for providing precisely targeted inspection areas to reduce nuisance and automated defect binning. With these technologies, the Kronos 1080 supports process control for packaging specific process steps, such as Cu-pillars, bumps, through silicon vias (TSVs) and redistribution layers (RDL).

Applications

Process monitor, Tool monitor, Outgoing Quality Control (OQC)

Related Products

CIRCL-AP: The Kronos inspection technology is also available as a module on the CIRCL defect inspection, metrology and review cluster tool.

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WI-2280

WI-2280 automated optical inspection and metrology system

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WI-2280

Multi-Substrate Defect Inspection and Metrology Systems

The WI-2280 automated optical inspection and metrology systems inspect and measure microelectronic devices on a variety of wafer substrates, supporting wafer-level packaging and post-dicing quality control for LED, VCSEL and other integrated circuit applications. It is capable of handling whole wafers from 2 to 8 inches and diced wafers on FFC or a hoop ring. With both inspection and 2D metrology capability, the WI-2280 systems provide feedback on the wafer surface quality; wafer dicing quality; and, critical dimension and overlay quality of bumps, pads and copper pillars. The systems are designed with IRIS (ICOS Review and Classification Software), which offers defect review and reclassification, for faster yield learning and improved process control.

Applications

Process monitor, Outgoing Quality Control (OQC), Tool monitor

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Zeta-5xx/6xx

Example image of the Zeta-5xx series output

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Zeta-5xx/6xx

Advanced Packaging Metrology Systems

The Zeta-5xx Series optical profilers are fully automated 300mm wafer metrology systems capable of measuring a variety of applications such as bump height, RDL (redistribution layer) CD, UBM (under bump metallization) step height, film thickness and wafer bow, which are critical to process control in advanced wafer-level packaging. Multi-mode optics save time and reduce cost by enabling a wide variety of measurement types on the single system, while the resulting high resolution 3D images and analysis provide the data required to enable process feedback cycles to drive yield improvement. For panel based wafer-level packaging applications, automated panel handling is available on the Zeta-6xx Series profilers, which offer the same metrology measurement capability as the 5xx Series.

Applications

Process monitor, Outgoing Quality Control (OQC), Tool monitor

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Klarity®

Closeup of a wafer

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Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications

Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction

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