8 Series

8 Series

High Productivity Patterned Wafer Broad Range Inspection Systems

The 8 Series patterned wafer inspection system detects a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The 8 Series enables cost-effective defect inspection of 150mm, 200mm or 300mm silicon and non-silicon substrate wafers from initial product development through volume production, helping fabs reduce the risk of excursions by providing higher lot and wafer sampling. The latest generation 8930 wafer defect inspection system features multi-mode LED scanning capability, FlexPoint™ precise area inspection, as well as automated wafer defect review and binning. These technologies enable high productivity capture of critical defects at a low nuisance rate, helping both leading-edge and legacy node IC fabs accelerate delivery of their products—reliably and at lower cost.

WI-2280

WI-2280

Multi-Substrate Defect Inspection and Metrology Systems

The WI-2280 automated optical inspection and metrology systems inspect and measure microelectronic devices on a variety of wafer substrates, supporting wafer-level packaging and post-dicing quality control for LED, VCSEL and other integrated circuit applications. It is capable of handling whole wafers from 2 to 8 inches and diced wafers on FFC or a hoop ring. With both inspection and 2D metrology capability, the WI-2280 systems provide feedback on the wafer surface quality; wafer dicing quality; and, critical dimension and overlay quality of bumps, pads and copper pillars. The systems are designed with IRIS (ICOS Review and Classification Software), which offers defect review and reclassification, for faster yield learning and improved process control.

Candela^® 8xxx

VCSEL array image courtesy of Philips Photonics

Candela^® 8xxx

Advanced Surface Inspection for Compound Semiconductor Materials

The Candela^® 8720 compound semiconductor material surface inspection system enables GaN-related materials, GaAs substrate and epi process control with high sensitivity to critical defects for production of power devices, communications and RF devices, and advanced LEDs (as well as upcoming microLEDs). With its proprietary optical design and detection technology, the Candela 8720 detects and classifies sub-micron defects that are not consistently identified by current inspection methods, supporting production-line monitoring for yield-limiting defects.

Candela^® CS920

Candela^® CS920

Integrated Solution for Surface Defect Detection and Photoluminescence Metrology

The Candela^® CS920 SiC substrate and epitaxy (epi) wafer surface defect inspection system for power device manufacturers provides full-surface, high-sensitivity defect inspection and accurate process feedback. This epi wafer surface defect detection system helps the industry improve SiC substrate quality, as well as optimize the epitaxial growth yields for both SiC epi and GaN-on-silicon processes. The CS920 enables significantly enhanced yield and reduced time-to-root cause by integrating surface defect detection and photoluminescence technology in one inspection platform capable of capturing yield-critical defects including sub-surface basal plane dislocations and all epi stacking faults.

Candela^® 71xx

Candela^® 71xx

Hard Disk Drive Media and Substrates Defect Inspection and Classification Systems

The Candela^® 71xx Series advanced media and substrate defect detection and classification system for hard disk drive manufacturing helps maximize yield and lower hard disk inspection cost. A dual optical path configuration enables classification of unique defect signatures for critical submicron defects, such as micro-pits, bumps, particles and buried defects. The Candela 7110 configuration supports manual loading of substrates for inspection, while the Candela 7140 provides fully automated cassette-to-cassette substrate loading.

A high sensitivity (HS) option provides enhanced sensitivity and capture rate for both bare glass and metal substrate inspection.

Candela^® 63xx

Candela^® 63xx

Hard Disk Drive Media and Substrates Topography Measurement and Defect Inspection System

The Candela^® 63xx dual laser-based inspection system provides surface inspection of hard disk drive substrates and finished media. Its unique multi-channel optical design enables roughness and waviness metrology measurements on both smooth metal and glass substrates. Defects, such as particles and scratches, can be automatically detected and classified using the same platform. The Candela 6310 is a manual system suited for both laboratory and low volume production, while the Candela 6340 is a fully automated cassette-to-cassette system for production environments.

ZetaScan

ZetaScan

High Throughput Defect Inspection for Large and Irregular Shaped Substrates

The ZetaScan Series high throughput defect inspection and classification systems are used in the display and solar industries on glass substrates, flat panels and other substrates. With a small laser scanning spot and four simultaneous inspection channels, the ZetaScan Series captures and classifies critical defects on a wide range of substrates, including rough ground, polished, unpolished, opaque and transparent substrates, and thin glass or bonded wafers. Utilizing a multi-mode approach to inspection, the ZetaScan Series defect inspectors provide high defect sensitivity at high throughput.

SensArray^® Process Probe™ 2070

SensArray^® Process Probe™ 2070

In Situ Flat Panel Temperature Monitoring System

The Process Probe™ 2070 instrumented glass tiles offer a cost-effective and flexible solution for reliable, in situ characterization of glass temperature profiles for many flat panel processing applications. Employing a number of small instrumented glass tiles rather than a single large panel of glass, the Process Probe 2070 allows the thermocouple sensors to be easily placed at desired locations on the susceptor within the process chamber. This flexible product design simplifies temperature measurements for LCD and other large-generation glass panel applications, enabling high accuracy process qualification and optimization.

Klarity^®

Klarity^®

Automated Defect and Yield Data Analysis

Klarity^® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity^® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity^® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Profiler Portfolio

Profiler Portfolio

Optical and Stylus Profilers

KLA offers a range of stylus and optical profilers that support surface metrology measurements for semiconductor IC, power device, LED, photonics, MEMS, CPV solar, HDD and display manufacturing. Please visit our profilers site for more details.

Nanomechanical Tester Portfolio

Nanomechanical Tester Portfolio

Nanomechanical Testers for Compound Semiconductor Manufacturing

KLA’s nanomechanical testers support microscale and nanoscale mechanical testing for semiconductor and MEMS industries. Please visit our nanomechanical testers site for more details.