Share

Defect Inspection and Review

Close up of a defect inspection wafer

Defect Inspection and Review

KLA-Tencor’s defect inspection and review systems cover the full range of yield applications within the chip and wafer manufacturing environments, including incoming process tool qualification, wafer qualification, research and development, and tool, process and line monitoring. Patterned and unpatterned wafer defect inspection and review systems find, identify and classify particles and pattern defects on the front surface, back surface and edge of the wafer. This information allows engineers to detect, resolve and monitor critical yield excursions, resulting in faster yield ramp and higher production yield.


39xx

3900 Series Broadband Plasma Patterned Wafer external cylinder

Interested in this product or have questions?

Contact us

39xx

Super Resolution Broadband Plasma Patterned Wafer Defect Inspection Systems

The 3900 Series broadband plasma defect inspection systems support wafer-level defect discovery, process debug and excursion monitoring for leading-edge IC devices. The 3900 Series uses innovative hardware technology to produce super resolution deep ultraviolet (SR-DUV) wavelength bands. When used in conjunction with advanced algorithms, such as pin•point™ and super•cell™, the 3900 Series’ SR-DUV provides high sensitivity capture of defects in yield-critical pattern locations on ≤10nm design node devices. With throughput that supports inline monitoring requirements, the 3900 Series pairs sensitivity with speed, enabling Discovery at the Speed of Light™, for reduction of the time required for defect discovery and the delivery of wafer-level data for complete characterization of process issues.

Applications

Defect discovery, Hotspot discovery, Process debug, EUV print check, Engineering analysis, Line monitoring, Process window discovery

Related Products

2930 and 2935: Optical broadband plasma wafer defect inspectors that complement the inspection performance of the 3900 Series for defect discovery on ≤10nm design node devices.

Interested in this product or have questions?

Contact us

29xx

2930 Series Broadband Plasma Patterned Wafer external cylinder

Interested in this product or have questions?

Contact us

29xx

Broadband Plasma Patterned Wafer Defect Inspection Systems

The 2930 Series broadband plasma defect inspection systems provide advancements in optical defect inspection, enabling discovery of yield-critical defects on leading-edge IC devices. Using enhanced broadband plasma illumination technology, new optical modes, and pin•point™ and super•cell™ technologies, the 2930 and 2935 broadband plasma defect inspectors provide the flexibility required to capture critical defects across the full range of process layers, material types and process stacks. The 2930 Series pairs sensitivity with optical wafer defect inspection speed, enabling Discovery at the Speed of Light™ – the combination of fast defect discovery and full characterization of defect issues at optimal cost of ownership. As the industry-standard for inline monitoring, the 29xx Series protects a fab's capital investment through upgrades and an extendible platform architecture.

Applications

Defect discovery, Hotspot discovery, Process debug, Engineering analysis, Line monitoring, Process window discovery

Related Products

3900 and 3905: Optical broadband plasma wafer defect inspectors with super resolution deep ultraviolet (SR-DUV) wavelength bands that complement the inspection performance of the 2930 Series for defect discovery on ≤10nm design node devices.

2920 and 2925: Optical broadband plasma wafer defect inspectors that provide yield-critical defect capture on 16nm and below memory and logic devices.

2910 and 2915: Optical broadband plasma wafer defect inspectors that provide yield-relevant defect capture on 2X/1Xnm memory and logic devices.

2900 and 2905: Optical broadband plasma wafer defect inspectors that provide capture of yield-relevant defects on 2Xnm memory and logic devices.

Interested in this product or have questions?

Contact us

Voyager™

Surfscan® SP3 unpatterned wafer inspection system

Interested in this product or have questions?

Contact us

Voyager™

Laser Scanning Patterned Wafer Defect Inspection Systems

The Voyager™ 1015 laser scanning inspection system supports production ramp defect monitoring, specializing in after-develop inspection (ADI) for both immersion (193i) and EUV lithography, when the wafer can still be reworked. A DUV laser, new optics design and largest collection solid angle produce the defect sensitivity required for the tight pitches found in ADI at advanced design nodes. Custom sensors and a switchable laser enable inspection of delicate photoresist materials, while oblique illumination and advanced algorithms suppress noise sources inherent to ADI inspections for more relevant results. The Voyager 1015 delivers high throughput capture of critical defects in the litho cell and other modules of the fab allowing process issues to be identified and rectified rapidly.

Applications

Line monitor, Tool monitor, Tool qualification, 193i and EUV resist qualification

Interested in this product or have questions?

Contact us

Puma™

Puma 9980 Laser Scanning Patterned Wafer system

Interested in this product or have questions?

Contact us

Puma™

Laser Scanning Patterned Wafer Defect Inspection Systems

The Puma™ 9980 laser scanning inspection system incorporates multiple sensitivity and speed enhancements that enable capture of critical defects of interest (DOI) at throughputs required for high volume manufacturing for 1Xnm advanced logic and advanced DRAM and 3D NAND memory devices. Part of a portfolio of advanced wafer defect inspection and review tools, the Puma 9980 provides the highest throughput solution for production ramp monitoring by enhancing capture of defect types on advanced patterning layers. The Puma 9980 incorporates NanoPoint™ design-aware capability, which produces more actionable inspection results through increased defect sensitivity, improved systematic nuisance binning and tightened defect coordinate accuracy.

Applications

Line monitor, Tool monitor, Tool qualification

Related Products

Puma 9850: Provides high sensitivity excursion monitoring in all die regions for 2X/1Xnm memory and logic devices.

Puma 9650: Provides high performance excursion monitoring in all die regions for ≤28nm memory and logic devices.

Puma 9500: Provides high performance excursion monitoring for ≤32nm memory and logic devices.

Interested in this product or have questions?

Contact us

8 Series

Closeup of 8 series High Productivity Patterned Wafer

Interested in this product or have questions?

Contact us

8 Series

High Productivity Patterned Wafer Broad Range Inspection Systems

The 8 Series patterned wafer inspection system detects a wide variety of defect types at very high throughput for fast identification and resolution of production process issues. The 8 Series enables cost-effective defect inspection of 150mm, 200mm or 300mm silicon and non-silicon substrate wafers from initial product development through volume production, helping fabs reduce the risk of excursions by providing higher lot and wafer sampling. The 8 Series wafer defect inspection systems feature LED scanning technology with a selectable spectrum, simultaneous brightfield and darkfield optical paths and automated wafer defect binning, which are designed to enable leading IC fabs and legacy node fabs to accelerate delivery of their products - reliably and at lower cost.

Applications

Process monitor, Tool monitor, Outgoing Quality Control (OQC)

Related Products

CIRCL: The 8 Series inspection technology is also available as a module on the CIRCL defect inspection, metrology and review cluster tool.

Interested in this product or have questions?

Contact us

CIRCL™

Zoomed in CIRCL All-Surface Wafer

Interested in this product or have questions?

Contact us

CIRCL™

All-Surface Wafer Defect Inspection, Metrology and Review Cluster System

The CIRCL™ cluster tool has four modules, covering all wafer surfaces and providing parallel data collection at high throughput for efficient process control. The modules comprising the latest-generation CIRCL5 system include: front side wafer defect inspection; wafer edge defect inspection, profile, metrology and review; backside wafer defect inspection and review; and, optical review and classification of front side defects. Data collection is controlled by DirectedSampling™, an innovative approach that uses results from one measurement to trigger other types of measurements within the cluster. The modular configuration of CIRCL5 offers flexibility for varying process control needs, saves overall fab space, reduces wafer queue time, and provides a cost-effective upgrade path to protect a fab's capital investment.

Applications

Process monitor, Outgoing Quality Control (OQC), Tool monitor, Backside monitor, Edge yield monitor

Interested in this product or have questions?

Contact us

Surfscan®

Surfscan® SP3 unpatterned wafer inspection system

Interested in this product or have questions?

Contact us

Surfscan®

Unpatterned Wafer Defect Inspection Systems

The Surfscan® SP7 unpatterned wafer inspection system supports leading-edge logic and memory design nodes through qualification of: processes, materials and tools, including those for EUV lithography, for IC manufacturing; advanced substrates, such as prime silicon, epitaxial, and SOI wafers, for substrate manufacturing; and process tool performance for equipment manufacturing. Using a DUV laser source with peak power control, a novel optical architecture, a range of spot sizes and advanced algorithms, the Surfscan SP7 delivers ultimate sensitivity and enhanced defect classification at high throughput for bare wafers, smooth and rough films, and fragile resists and litho stacks. The Surfscan SP7 also integrates a high resolution SURFmonitor™ module that characterizes surface quality and detects subtle defects, helping qualify processes and tools.

Applications

Process qualification, Tool qualification, Tool monitoring, Outgoing wafer quality control, Incoming wafer quality control, EUV resist and scanner qualification, Process debug

Related Products

Surfscan SP5XP: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 1Xnm design nodes.

Surfscan SP5: Unpatterned wafer surface inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2X/1Xnm design nodes.

Surfscan SP3: Unpatterned wafer inspection system with DUV sensitivity and high throughput for IC, substrate and equipment manufacturing at the 2Xnm design node.

Interested in this product or have questions?

Contact us

eDR7xxx™

e-Beam Wafer Defect Review and Classification Systems

Interested in this product or have questions?

Contact us

eDR7xxx™

e-Beam Wafer Defect Review and Classification Systems

The eDR7280™ electron-beam (e-beam) wafer defect review and wafer classification system captures high resolution images of defects in order to produce an accurate representation of the defect population on a wafer. Utilizing fifth-generation e-beam immersion optics and Real-Time Automatic Defect Classification (RT-ADC 2.0) capability, the eDR7280 defect review system delivers the performance required to re-locate, image and classify yield-critical defects for leading-edge design nodes. The eDR7280 features several innovative applications that address a broad range of fab use cases, including critical point inspection (CPI), reticle defect review, unpatterned wafer defect review and process window qualification.

Applications

Defect imaging, Wafer defect classification, Bare wafer outgoing and incoming quality control, Wafer dispositioning, Hotspot discovery, Defect discovery, EUV print check, Process window discovery, On-wafer reticle defect review, Process window qualification

Interested in this product or have questions?

Contact us

Ready to get started?

Contact Us