Data Analytics

Data Analytics

KLA’s data analytics systems centralize and analyze the data produced by inspection, metrology and process systems. Using advanced data analysis, modeling and visualization capabilities, our comprehensive suite of data analytics products support applications such as run-time process control, defect excursion identification, wafer and reticle dispositioning, scanner and process corrections, and defect classification. By providing chip and wafer manufacturers with relevant root cause information, our data management and analysis systems accelerate yield learning rates and reduce production risk.

RDC

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RDC

Reticle Data Analysis and Management

The RDC (Reticle Decision Center) comprehensive data analysis and management system supports multiple KLA reticle inspection and metrology platforms for reticle qualification. RDC provides a wide array of applications that drive automated defect disposition decisions, improve cycle time and reduce the reticle-related patterning errors that can affect yield. In addition to providing critical applications, RDC serves as a central data management system utilizing a high reliability, flexible server configuration.

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Klarity®

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Klarity®

Automated Defect and Yield Data Analysis

Klarity® Defect automated defect analysis and data management system helps fabs achieve faster yield learning cycles through real-time excursion identification. Klarity® SSA (Spatial Signature Analysis) analysis module for Klarity Defect provides automatic detection and classification of defect signatures that indicate process issues. Klarity® ACE XP advanced yield analysis system helps fabs capture, retain and share yield learning within and across fabs for yield acceleration. Klarity systems utilize an intuitive decision flow analysis, allowing engineers to easily create customized analyses that support applications such as lot dispositioning, review sampling, defect source analysis, SPC setup and management, and excursion notifications. Klarity Defect, Klarity SSA and Klarity ACE XP form a fab-wide yield solution that automatically reduces defect inspection, classification and review data to relevant root-cause and yield-analysis information. Klarity data helps IC, packaging, compound semi and HDD manufacturers take corrective action sooner, resulting in accelerated yield and better time to market.

Applications
Defect data analysis, Wafer disposition, Process and tool excursion identification, Spatial signature analysis, Yield analysis, Yield prediction
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5D Analyzer®

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5D Analyzer®

Advanced Data Analysis and Patterning Control

5D Analyzer® is a run-time process control solution with supporting analytics and visualization for advanced node process optimization, process monitoring and patterning control. It accepts data from a broad range of sources across the fab, including: overlay, reticle registration, wafer geometry, chamber temperature, films, CD, and profile metrology systems; process tools; and scanners. With applications such as advanced overlay analysis and correlation of reticle and wafer shape data to patterning errors, 5D Analyzer enables a variety of offline and real-time use cases for advanced patterning control.

Applications
Run-time process control, Overlay control, Scanner qualification, Scanner correction, Process correction, Patterning control
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ProDATA

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ProDATA

Process Window Analysis

ProDATA™ V2.1 process window analysis software provides a systematic, robust approach to understanding and optimizing lithography processes across the fab. This powerful software speeds critical decision making by enabling fast, easy and accurate analysis of experimental data, including critical dimension (CD) analysis, roughness, sidewall angle, top loss and pattern collapse.

Applications
Stepper qualification, Lithography process optimization, Reticle verification and qualification, Lithography tool monitoring data analysis, Photoresist performance analysis
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