KLA’s Dr. Klaus-Dieter Roeth and Dr. Moshe Preil are invited speakers at PhotoMask Japan 2019. Dr. Roeth will discuss “Fast Local Registration Measurements for Efficient e-Beam Writer Qualification and Correction” in Session 4: Writing & Metrology. Dr. Preil will discuss “Open Issues in Mask Technology as EUV Enters High Volume Manufacturing” in Session 9: EUVL II.

PhotoMask Japan 2019 is the 26th international symposium on photomasks and NGL masks. The aim of the symposium is to bring together engineers and investigators from Japan, USA, and all over the world in the field of photomasks, NGL masks, and related technologies to discuss recent progress, applications, and future trends.

KLA’s Stephen Hiebert will present “Inspection and Metrology Challenges for 3DIC Interconnect Scaling” in the memory session.

For the 5th year, NCAP and Yole Développement will combine their expertise to build an innovative program dedicated to the advanced packaging industry. The program was created to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

KLA is pleased to be an exhibitor and sponsor of the 2019 MRS Spring Meeting & Exhibit. We invite you to visit us at our booth to learn more about our surface profiler and nanomechanical characterization tools.

The 2019 MRS Spring Meeting & Exhibit is a key forum to present research to an interdisciplinary and international audience. It provides a window on the future of materials science and offers an opportunity for researchers—from students and postdoctoral fellows, to Nobel and Kavli Prize Laureates—to exchange technical information and network with colleagues.

KLA customers will present their innovative process control work on many different types of IC devices plus wafer-level packaging. Presentation topics and schedule are listed here. KLA’s Janay Camp will co-chair the Yield Enhancement / Yield Methodologies session on Tuesday, May 7, 2019.

The SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference, with technical sponsorship from IEEE Electron Devices and Electronics Packaging Societies, provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies.

KLA is continuing the tradition of sponsoring SEMICON Southeast Asia. We invite you to visit booth #619 to meet our experts and learn more about the features and benefits of our wafer-level and component-level packaging inspection systems.

SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends. Bringing solutions to industry challenges that can best be addressed at the event!