Indentation University – Session 16: How to Test Rubber Compounds and Interface Layers in Tire Cross-Sections

Traditional testing of laminate layers in a tire requires extensive dissection and can negatively impact the results. ProbeDMA™ eliminates the need to individually dissect the tire layers and allows the quantification of viscoelastic properties with high spatial resolution across layers and at interfaces. This session is a live demonstration of nanoindentation with the KLA nanoindenter to characterize the viscoelastic properties of tire cross-sections. KLA application engineers will demonstrates sample preparation, instrument configuration, test specification, execution and data interpretation.

Register here

Event Dates Wednesday July 8, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)


KLA is proud to be a continuing platinum sponsor and exhibitor at SEMICON West. We invite you to visit our experts at booth #144 to learn more about our contact and non-contact profilers and thin-film measurement systems. We also invite you to visit the
SPTS, a KLA Company, booth #827 to learn about their wafer processing technologies solutions. We look forward to seeing you!

SEMICON West is the premier annual event for highlighting the latest innovations, products, processes, and services for the design and manufacture of today’s most sophisticated electronics. It is where the industry gets a glimpse at what is next and finds its innovation engines.

Event Dates Tuesday, July 21 to
Thursday, July 23, 2020
Booth 144, 827
Location Moscone Center, San Francisco, CA

Microscopy & Microanalysis 2020

KLA is exhibiting at Microscopy & Microanalysis 2020. Learn about the latest innovations in optical profilometry and nanoindentation at booth #225.

Microscopy & Microanalysis is the premier meeting for scientists, technologists, and students who use microscopy or microanalysis in their research.

Event Dates Monday, August 3 to
Thursday, August 6, 2020
Booth 225
Location Wisconsin Center, Milwaukee, WI

SEMICON Southeast Asia

KLA is proud to continue its sponsorship of SEMICON Southeast Asia. We invite you to visit booth #1422 to meet our experts and learn more about the features and benefits of our wafer-level and component-level packaging inspection systems.

SEMICON Southeast Asia is an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers in the industry, demonstrates the most advanced products and showcases the most up-to-date market and technology trends.

Event Dates Tuesday, August 11 to
Thursday, August 13, 2020
Booth 1422
Location The Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, Malaysia

Indentation University – Session 17: High-speed Nanoindentation

With careful attention to instrumentation and software, nanoindentation experiments can be accomplished at a rate faster than one second per indent. High-speed indentation opens new doors for statistical analysis and mechanical-properties mapping.

Register here

Event Dates Wednesday, August 12, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)

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