Candela^® 8520 is KLA Instrument’s latest bare wafer defect inspection platform for power device materials and applications. It is the successor to the award-winning Candela^® CS920. This webinar would discuss how integrated topographic defect detection and photoluminescence technology on Candela 8520 helps SiC power device manufacturers reduce yield loss from epitaxial defects and improve MOCVD reactor process control.

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3D printing is the disruptive manufacturing method of the 21st century. In many ways, it is inferior to traditional methods of casting and machining, because microstructure and defects are not well understood or controlled. Yet, the technique is irresistible due to its speed, simplicity, and portability. High-speed nanoindentation is a critical tool for understanding the link between microstructure, elasticity, and strength in 3D printed materials, leading to better printing and processing methods for safety and reliability. This session is a live demonstration of mapping the hardness and Young’s modulus of 3D-printed titanium. Having previously demonstrated sample preparation, Mr. Crawford demonstrates all aspects of testing, including instrument configuration, test specification, and interpretation of results.

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The first foray into the vast number of applications that optical profilometers serve; measuring step heights (coating thickness, etch depth, etc.). We will cover basic topics such as: sample preparation, best practices for data acquisition, and various methods for calculating a step height. We will also discuss transparent films and step heights for different materials, including metals.

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KLA is pleased to be an exhibitor and a sponsor at SEMICON Europa 2020. We invite you to visit our SensArray team at our booth C1218 to discuss in situ process management and our Filmetrics team at our booth C1148 to learn about our thin-film measurement systems.

SPTS Technologies, a KLA Company, invites you to visit their booth C1619 to learn about their wafer processing technologies and solutions.

SEMICON Europa is the annual premier event for the global electronics industry in Europe. The event covers new products and technologies for electronics design and manufacturing, and features technologies from across the electronics supply chain, from electronic design automation to device fabrication (wafer processing) to final manufacturing (assembly, packaging, and test).

This webinar will discuss detecting, mapping, and insitu optical characterization of defects using the Zeta non-contact 3D surface topography measurement system. The Zeta platform is powered by ZDot™ technology and multi-mode optics, enabling measurement of a variety of samples: transparent and opaque, low to high reflectance, and smooth to rough texture. It provides topographic step height, roughness and film thickness measurements along with True Color imaging, and diamond scribe marking of defect locations for off-line post-detection analysis. The Zeta family comprises benchtop and fully automated cassette-to-cassette wafer handling to support both R&D and production environments.

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