PhotoMask Japan 2019

KLA’s Dr. Klaus-Dieter Roeth and Dr. Moshe Preil are invited speakers at PhotoMask Japan 2019. Dr. Roeth will discuss “Fast Local Registration Measurements for Efficient e-Beam Writer Qualification and Correction” in Session 4: Writing & Metrology. Dr. Preil will discuss “Open Issues in Mask Technology as EUV Enters High Volume Manufacturing” in Session 9: EUVL II.

PhotoMask Japan 2019 is the 26th international symposium on photomasks and NGL masks. The aim of the symposium is to bring together engineers and investigators from Japan, USA, and all over the world in the field of photomasks, NGL masks, and related technologies to discuss recent progress, applications, and future trends.

Event Dates Tuesday, April 16, 2019
Wednesday, April 17, 2019
Thursday, April 18, 2019
Location Pacific Convention Plaza (“Pacifico”) Yokohama, Yokohama, Japan

NCAP and Yole Développement Symposium

KLA’s Stephen Hiebert will present “Inspection and Metrology Challenges for 3DIC Interconnect Scaling” in the memory session.

For the 5th year, NCAP and Yole Développement will combine their expertise to build an innovative program dedicated to the advanced packaging industry. The program was created to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

Event Dates Monday, April 22, 2019
Tuesday, April 23, 2019
Location Grand Mercure Shanghai Century Park, Shanghai, China

2019 MRS Spring Meeting & Exhibit

KLA is pleased to be an exhibitor and sponsor of the 2019 MRS Spring Meeting & Exhibit. We invite you to visit us at our booth to learn more about our surface profiler and nanomechanical characterization tools.

The 2019 MRS Spring Meeting & Exhibit is a key forum to present research to an interdisciplinary and international audience. It provides a window on the future of materials science and offers an opportunity for researchers—from students and postdoctoral fellows, to Nobel and Kavli Prize Laureates—to exchange technical information and network with colleagues.

Event Dates Tuesday, April 23, 2019
Wednesday, April 24, 2019
Location Phoenix Convention Center, Phoenix, AZ

ASMC 2019

KLA customers will present their innovative process control work on many different types of IC devices plus wafer-level packaging. Presentation topics and schedule are listed here. KLA’s Janay Camp will co-chair the Yield Enhancement / Yield Methodologies session on Tuesday, May 7, 2019.

The SEMI Advanced Semiconductor Manufacturing Conference (ASMC) is the leading international technical conference for exploring solutions to improve the collective micro-electronics manufacturing expertise. The conference, with technical sponsorship from IEEE Electron Devices and Electronics Packaging Societies, provides an unparalleled platform for semiconductor professionals to network and learn the latest information in the practical application of advanced manufacturing strategies and methodologies.

Event Dates Monday, May 6, 2019
Tuesday, May 7, 2019
Wednesday, May 8, 2019
Thursday, May 9, 2019
Location Saratoga Springs City Center, Saratoga, NY

SEMICON Southeast Asia

KLA is continuing the tradition of sponsoring SEMICON Southeast Asia. We invite you to visit booth #619 to meet our experts and learn more about the features and benefits of our wafer-level and component-level packaging inspection systems.

SEMICON Southeast Asia has become an important exposition for the electronics industry in Southeast Asia. The show connects the decision makers from the industry, demonstrates the most advanced products and brings in the most up-to-date market and technology trends. Bringing solutions to industry challenges that can best be addressed at the event!

Event Dates Tuesday, May 7, 2019
Wednesday, May 8, 2019
Thursday, May 9, 2019
Booth 619
Location Malaysia International Trade and Exhibition Centre (MITEC), Kuala Lumpur, Malaysia

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