Process Control at the Source

ASMC 2018 Schedule

SEMI Advanced Semiconductor Manufacturing Conference
Saratoga Hilton, Saratoga Springs, New York

April 30 - May 3, 2018

Download the complete schedule

10:05 a.m.
- 10:30 a.m.
Paper 1.1
Advanced Defect Inspection Techniques for NFET and PFET Defectivity at 7nm Gate Poly Removal Process
Ian Tolle, GLOBALFOUNDRIES, Inc.; Michael Daino, KLA-Tencor Corporation
10:55 a.m.
- 11:20 a.m.
Paper 1.3
Defect Learning Methodology Applied to Microbump Process at 20μm Pitch and Below
M. Liebens, J. Slabbekoorn, A. Miller, E. Beyne, imec; M. Stoerring, M. Wiesiollek, S. Hiebert, A. Cross, KLA-Tencor Corporation
11:20 a.m.
- 11:45 a.m.
Paper 1.4
Design Systematic Weak Point Discovery Optimization
29xx, 39xx
Sonal Singh, Panneer Selvan Venkatachalam, Julie Lee, GLOBALFOUNDRIES US; Michael Daino, Barry Saville and Chet Lenox, KLA-Tencor Corporation
5:15 p.m.
- 6:45 p.m.
Session 5
Measuring the Wafer Temperature in HVM Process Tools using a New Approach with Automated Wireless HighTemp-400 and EtchTemp-SE Wafer Systems
Factory Automation
HighTemp 400,
DY Kim, J.I. Kim, SK Hynix; Dinh Chu, DongChul Hong, KLA-Tencor Corporation
10:00 a.m.
- 10:25 a.m.
Paper 14.1
Impact of Scribe Line (Kerf) Defectivity on Wafer Yield
Puma 9850
Ludmila Popova, Tracy Huang, Hye Jin Lee, Yining Zang, ChiaHao Tsao, Thirukumaran Mahalingam, Haiting Wang, Amit Gupta, Julie Lee, GLOBALFOUNDRIES Fab 8; Towshif Ali, Joseph Matthew Kaule, KLA-Tencor Corporation
10:25 a.m.
- 10:50 a.m.
Paper 14.2
Bare Wafer Analysis for Wet Cleaning Efficiency – The Impact of Classification and Sensitivity
Surfscan SP5
Kay Wendt, Fabian Wilbers, GLOBALFOUNDRIES Fab 1; Frank Holsteyns, Christophe Lorant, imec; Jochen Ruth, PALL; John Newby, Gerhard Bast, KLA-Tencor Corporation