Process Control at the Source

ASMC 2018 Schedule

SEMI Advanced Semiconductor Manufacturing Conference
Saratoga Hilton, Saratoga Springs, New York

April 30 - May 3, 2018

Download the complete schedule

10:05 a.m.
- 10:30 a.m.
Paper 1.1
Advanced Defect Inspection Techniques for NFET and PFET Defectivity at 7nm Gate Poly Removal Process
Products:
29xx
Ian Tolle, GLOBALFOUNDRIES, Inc.; Michael Daino, KLA-Tencor Corporation
10:55 a.m.
- 11:20 a.m.
Paper 1.3
Defect Learning Methodology Applied to Microbump Process at 20μm Pitch and Below
Products:
CIRCL-AP
M. Liebens, J. Slabbekoorn, A. Miller, E. Beyne, imec; M. Stoerring, M. Wiesiollek, S. Hiebert, A. Cross, KLA-Tencor Corporation
11:20 a.m.
- 11:45 a.m.
Paper 1.4
Design Systematic Weak Point Discovery Optimization
Products:
29xx, 39xx
Sonal Singh, Panneer Selvan Venkatachalam, Julie Lee, GLOBALFOUNDRIES US; Michael Daino, Barry Saville and Chet Lenox, KLA-Tencor Corporation
5:15 p.m.
- 6:45 p.m.
Session 5
poster
Measuring the Wafer Temperature in HVM Process Tools using a New Approach with Automated Wireless HighTemp-400 and EtchTemp-SE Wafer Systems
Products:
Factory Automation
System,
HighTemp 400,
EtchTemp-SE
DY Kim, J.I. Kim, SK Hynix; Dinh Chu, DongChul Hong, KLA-Tencor Corporation
10:00 a.m.
- 10:25 a.m.
Paper 14.1
Impact of Scribe Line (Kerf) Defectivity on Wafer Yield
Products:
Puma 9850
Ludmila Popova, Tracy Huang, Hye Jin Lee, Yining Zang, ChiaHao Tsao, Thirukumaran Mahalingam, Haiting Wang, Amit Gupta, Julie Lee, GLOBALFOUNDRIES Fab 8; Towshif Ali, Joseph Matthew Kaule, KLA-Tencor Corporation
10:25 a.m.
- 10:50 a.m.
Paper 14.2
Bare Wafer Analysis for Wet Cleaning Efficiency – The Impact of Classification and Sensitivity
Products:
Surfscan SP5
Kay Wendt, Fabian Wilbers, GLOBALFOUNDRIES Fab 1; Frank Holsteyns, Christophe Lorant, imec; Jochen Ruth, PALL; John Newby, Gerhard Bast, KLA-Tencor Corporation