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SPIE Photomask Technology + EUV Lithography 2018 Exhibition is the premier worldwide technical meeting for mask making, emerging mask technologies, and the future of the mask business.

imec and KLA-Tencor are co-authors of the presentation “EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems” in the EUV Conference Session 3: EUV Process Control.

SK Hynix and KLA-Tencor are co-authors of the presentation “Non-Gaussian CD distribution characterization for DRAM application in EUV lithography” in the EUV Conference Session 3: EUV Process Control.

Micron and KLA-Tencor are co-authors of the poster “Validation of EUV mask defect disposition using SEM-2-Aerial” in the EUV Conference Poster Session PS1: EUV Mask.

Fractilia and KLA-Tencor are co-authors of the poster “Study of roughness components in the frequency domain via experimental and simulated images” in the EUV Conference Poster Session PS5: Process Control.

KLA-Tencor will present “Fast local registration measurements for efficient e-beam writer qualification and correction (Best EMLC Paper)” in the Photomask Technology Conference Session 3: Mask Inspection, Metrology, and Repair.

These two conferences are being held in one location: Monterey Conference Center and Monterey Marriott, Monterey, CA.
Event Dates Monday, September 17, 2018
Tuesday, September 18, 2018
Wednesday, September 19, 2018
Location Monterey Conference Center, Monterey, CA

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