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KLA-Tencor’s Eric Yang will present an invited talk, “How Can Inspection and Metrology Enable a Zero Defect Strategy for Automotive Packages,” at the SiP Conference China 2018 (Track 8: Test Solutions for Automotive SiP).

The SiP Conference China 2018 provides dynamic learning and technology updates for SiP (system in package) related trends and new engineering innovations from the industry’s world SiP leaders.
Event Dates Thursday, December 20, 2018
Friday, December 21, 2018
Saturday, December 22, 2018
Location Shenzhen Convention and Exhibition Center, Shenzhen, China

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