Sigma fxP – Metal Deposition for Power Devices

Jun 15, 2021

Talking Poster (with captions) – Introduction to physical vapor deposition (PVD) of metal layers for power devices. The processes include thick Al deposition to the frontside of the wafer where SPTS’s Sigma fxP system can deposit thick films with a high deposition rate to increase productivity, but without the film defects normally associated with high rate deposition. For depositing metals on the back side of the power device wafer, a stack of different metals are required. For back side metal deposition, effective low damage pre-clean and stress control are paramount. (4mins:37secs)

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