Power Device Inspection Solution

What's beneath the drape redefines performance for power device manufacturers

High sensitivity to surface and crystallographic defects at substrate and epitaxy

Unique signature from high resolution imaging, enabling convenient defect review.

CMP scratches on SiC substrates
Close up of CMP scratches on SiC substrates
Close up of stress region and micropipes on SiC substrates

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High sensitivity to surface and crystallographic defects at substrate and epitaxy

Unique signature from high resolution imaging, enabling convenient defect review.

CMP scratches on SiC substrates
Close up of CMP scratches on SiC substrates
Close up of stress region and micropipes on SiC substrates

Integrated surface and photoluminescence channels for SiC epitaxy defect detection

Surface triangles are device killers

Step bunching are potential yield killers

Stacking faults detected by photo-luminescence channel

BPD detection & imaging

Compound Semi

Compound Semi | MEMS | HDD Manufacturing

Compound Semi

KLA has a comprehensive portfolio of inspection, metrology, and data analytics systems to support power devices, RF communications, LED, photonics, MEMS, CPV solar and display manufacturing.

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