High Brightness LED (“HB-LED”) usage is increasing for new applications as LED manufacturing process costs decrease and performance improves. HB-LED wafer applications such as mobile phone LCD screens and keypads and flashlights for camera phones have been the drivers for HB-LED wafer manufacturing market growth in the last couple of years, as well as car headlights, LCD TV backlights and traffic signaling. HB-LED’s typically are used for high-end applications, making LED manufacturing quality control imperative. Our ICOS LED wafer inspection system offers outgoing automated visual inspection of HB-LED wafer manufacturing process for quality of the wafer surface.

HB-LED Wafer Manufacturing Inspection

Wafer Defect Inspection
MOCVD Process Control

  • Candela 8720 LED Defect Inspection: Enabling improved substrate surface metrology and epi process control with high sensitivity to yield-limiting wafer defects
  • Candela CSxx: Candela LED wafer defect inspection and classification systems for compound semiconductor and optoelectronic materials
  • ICOS WI-2280: Next-generation inspection capabilities and flexibility for LED wafer applications.

Surface Metrology
Stylus Profiling

  • HRP-260: Automated high resolution stylus profiler for measurement of step height, CMP, roughness, and stress
  • P-17: Manual load stylus profiler for measurement of step height, roughness, and stress

Optical Profiling

  • MicroXAM-800: Manual load optical profiler for substrate edge roll-off, roughness, and 3D epi defect characterization