KLA-Tencor’s advanced optical inspection and e-beam review systems employ innovative technologies to address 10nm design node yield challenges. This comprehensive wafer inspection and review portfolio supports discovery and control of yield-critical defects at all stages of IC manufacturing – from early process characterization to production process monitoring.
Broadband plasma patterned wafer inspectors with SR-DUV optical sensitivity and optical inspection speed for defect discovery and process debug.Learn more >
Broadband plasma patterned wafer inspectors with DUV/UV optical sensitivity and increased throughput for defect discovery and monitoring.Learn more >
E-beam defect review and classification system with enhanced imaging and RT-ADC 2.0 for accelerated identification of yield-relevant defects.Learn more >
Laser scanning patterned wafer inspector with diverse defect type capture for high throughput production ramp monitoring across a wide range of applications.Learn more >
All-surface patterned wafer inspection, review and metrology cluster with parallel data collection for fast, cost-efficient process monitoring.Learn more >
Extended DUV unpatterned wafer inspection system for cost-effective, early detection of yield-relevant process and tool excursions.Learn more >