KLA-Tencor will deliver two presentations at SEMICON Korea 2019: “A Systematic Approach to Integrate Metrology and Inspection,” (Poh-Boon Yong) and “Enabling EUV Materials Defectivity Qualification with Unpatterned Wafer Inspection,” (Ming Li). Both presentations are part of the Metrology and Inspection Forum on Thursday January 24, 2019. SEMICON Korea 2019 will showcase the latest semiconductor materials, equipment and related technologies. Special features include a semiconductor technology symposium, market seminar, supplier search programs and networking events to exchange the latest information.