The Electronics Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. The conference features about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT (Components, Packaging and Manufacturing Technology) Seminar, and a technology corner for exhibitors. A KLA-Tencor co-authored paper “Extreme thinning of Si wafers for via-last and multi wafer stacking applications” will be presented in Session 33: Next-Generation Materials and Processes for Through Vias and 3D Interconnects on June 1.