Upcoming events

A core mission of the Materials Research Society is to promote leading-edge research on materials around the world. The IMRC offers a range of symposium topics of interest to the materials research community.

Please come and see us at booth numbers 17 and 18 at the International Materials Research Congress show to discuss the advantages of our contact and non-contact profilers as well as our new line of nanoindenters and nano tensile tester.
Event Dates Sunday, August 19, 2018
Monday, August 20, 2018
Tuesday, August 21, 2018
Wednesday, August 22, 2018
Thursday, August 23, 2018
Friday, August 24, 2018
Location JW Marriott Cancun Resort & Spa, Cancún, Mexico
Booth 17 & 18
KLA-Tencor is exhibiting at the biennial European Conference on Silicon Carbide and Related Materials. Visit us to learn more about our suite of metrology and inspection systems.

The European Conference on Silicon Carbide and Related Materials (ECSCRM) is a highly-anticipated international forum that brings together world-leading specialists working in different areas of wide-bandgap semiconductors.
Event Dates Sunday, September 2, 2018
Monday, September 3, 2018
Tuesday, September 4, 2018
Wednesday, September 5, 2018
Thursday, September 6, 2018
Location The International Conference Centre, Birmingham, United Kingdom
KLA-Tencor will be exhibiting at SEMICON Taiwan and is proud to be a sponsor.

SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. This event connects companies, people, products and information that shape the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, photovoltaics and related advanced electronics.

KLA-Tencor authors will present at four forums. Neeraj Khanna will present “Inspection Strategies for EUV Lithography Qualification and Monitoring” at the IC Forum, while Stephen Hiebert will talk about “Defect Inspection for High-Density Fan-Out SiP Applications” at the SiP Global Summit. Akash Nanda discusses “Defect Inspection and Metrology for III-V Compound Semiconductor Wafers” in the Power and Compound Semiconductor Forum, and Jeroen Hoet will present “Innovative Technique for Advanced Fan-In Wafer Level Package Process Control” in the Advanced Packaging Technology Symposium.
Event Dates Wednesday, September 5, 2018
Thursday, September 6, 2018
Friday, September 7, 2018
Location Taipei Nangang Exhibition Center 1 & 4F, Taiwan
SPIE Photomask Technology + EUV Lithography 2018 Exhibition is the premier worldwide technical meeting for mask making, emerging mask technologies, and the future of the mask business.

imec and KLA-Tencor are co-authors of the presentation “EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems” in the EUV Conference Session 3: EUV Process Control.

SK Hynix and KLA-Tencor are co-authors of the presentation “Non-Gaussian CD distribution characterization for DRAM application in EUV lithography” in the EUV Conference Session 3: EUV Process Control.

Micron and KLA-Tencor are co-authors of the poster “Validation of EUV mask defect disposition using SEM-2-Aerial” in the EUV Conference Poster Session PS1: EUV Mask.

Fractilia and KLA-Tencor are co-authors of the poster “Study of roughness components in the frequency domain via experimental and simulated images” in the EUV Conference Poster Session PS5: Process Control.

KLA-Tencor will present “Fast local registration measurements for efficient e-beam writer qualification and correction (Best EMLC Paper)” in the Photomask Technology Conference Session 3: Mask Inspection, Metrology, and Repair.

These two conferences are being held in one location: Monterey Conference Center and Monterey Marriott, Monterey, CA.
Event Dates Monday, September 17, 2018
Tuesday, September 18, 2018
Wednesday, September 19, 2018
Location Monterey Conference Center, Monterey, CA
ICPT is an annual conference covering all aspects of chemical-mechanical polishing. The conference will provide an international forum for academic researchers, industrial practitioners and engineers from around the world for the exchange of information on state-of-the-art research in CMP technology.

KLA-Tencor’s Andrew Cross will present a coauthored paper with imec, “On-Product Metrology at High Resolution Over Full Wafer — Applications for CMP & Fin Process Development” during the conference.
Event Dates Sunday, October 14, 2018
Monday, October 15, 2018
Tuesday, October 16, 2018
Wednesday, October 17, 2018
Location The K Hotel, Seoul, South Korea