Upcoming events

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KLA-Tencor is exhibiting at the biennial European Conference on Silicon Carbide and Related Materials. Visit us to learn more about our suite of metrology and inspection systems.

The European Conference on Silicon Carbide and Related Materials (ECSCRM) is a highly-anticipated international forum that brings together world-leading specialists working in different areas of wide-bandgap semiconductors.
Event Dates Sunday, September 2, 2018
Monday, September 3, 2018
Tuesday, September 4, 2018
Wednesday, September 5, 2018
Thursday, September 6, 2018
Location The International Conference Centre, Birmingham, United Kingdom
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KLA-Tencor will be exhibiting at SEMICON Taiwan and is proud to be a sponsor.

SEMICON Taiwan is the premier event in Taiwan for microelectronics manufacturing. This event connects companies, people, products and information that shape the future of design and manufacturing for semiconductors, nanoelectronics, MEMS, photovoltaics and related advanced electronics.

KLA-Tencor authors will present at four forums. Neeraj Khanna will present “Inspection Strategies for EUV Lithography Qualification and Monitoring” at the IC Forum, while Stephen Hiebert will talk about “Defect Inspection for High-Density Fan-Out SiP Applications” at the SiP Global Summit. Dr. Varun Gupta discusses “Defect Inspection and Metrology for III-V Compound Semiconductor Wafers” in the Power and Compound Semiconductor Forum, and Jeroen Hoet will present “Innovative Technique for Advanced Fan-In Wafer Level Package Process Control” in the Advanced Packaging Technology Symposium.
Event Dates Wednesday, September 5, 2018
Thursday, September 6, 2018
Friday, September 7, 2018
Location Taipei Nangang Exhibition Center 1 & 4F, Taiwan
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SPIE Photomask Technology + EUV Lithography 2018 Exhibition is the premier worldwide technical meeting for mask making, emerging mask technologies, and the future of the mask business.

imec and KLA-Tencor are co-authors of the presentation “EUV stochastic defect monitoring with advanced broadband optical wafer inspection and e-beam review systems” in the EUV Conference Session 3: EUV Process Control.

SK Hynix and KLA-Tencor are co-authors of the presentation “Non-Gaussian CD distribution characterization for DRAM application in EUV lithography” in the EUV Conference Session 3: EUV Process Control.

Micron and KLA-Tencor are co-authors of the poster “Validation of EUV mask defect disposition using SEM-2-Aerial” in the EUV Conference Poster Session PS1: EUV Mask.

Fractilia and KLA-Tencor are co-authors of the poster “Study of roughness components in the frequency domain via experimental and simulated images” in the EUV Conference Poster Session PS5: Process Control.

KLA-Tencor will present “Fast local registration measurements for efficient e-beam writer qualification and correction (Best EMLC Paper)” in the Photomask Technology Conference Session 3: Mask Inspection, Metrology, and Repair.

These two conferences are being held in one location: Monterey Conference Center and Monterey Marriott, Monterey, CA.
Event Dates Monday, September 17, 2018
Tuesday, September 18, 2018
Wednesday, September 19, 2018
Location Monterey Conference Center, Monterey, CA

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