Upcoming events

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The AEC (Automotive Electronics Council) is holding their First European Automotive Electronics Reliability Workshop. The goal of the Automotive Electronics Council is the development of uniform automotive industry specifications and requirements to improve automotive product quality and reliability while reducing cost and time to market. This workshop provides a forum for the international automotive component supplier base to discuss quality challenges, reliability issues, and philosophies related to all aspects of passive component, discrete semiconductor and integrated circuit design, test, analysis, fabrication, assembly and field performance.

KLA-Tencor’s David Price will be presenting “Application of Inline Defect Part Average Testing to Reduce Latent Reliability Defect Escapes.”
Event Dates Tuesday, October 16, 2018
Wednesday, October 17, 2018
Location Sheraton Munich Westpark Hotel, Munich, Germany
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KLA-Tencor’s Eric Yang will present an invited talk, “How Can Inspection and Metrology Enable a Zero Defect Strategy for Automotive Packages,” at the SiP Conference China 2018 (Track 8: Test Solutions for Automotive SiP).

The SiP Conference China 2018 provides dynamic learning and technology updates for SiP (system in package) related trends and new engineering innovations from the industry’s world SiP leaders.
Event Dates Wednesday, October 17, 2018
Thursday, October 18, 2018
Friday, October 19, 2018
Location Hongqiao Jin Jiang Hotel, Shanghai, China
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KLA-Tencor is a sponsor of the International Workshop on Advanced Patterning Solutions. In addition to KLA-Tencor’s sponsorship, Satya Kurada will present “Discovery at the Speed of Light: Optical Inspection for Process Optimization.”

IWAPS provides a forum for the experts from industry and research institutions worldwide to present and discuss patterning and related challenges such as material, equipment, process, metrology, computational lithography and design optimization.
Event Dates Thursday, October 18, 2018
Friday, October 19, 2018
Location Double Tree by Hilton Hotel, Xiamen-Haicang, China
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KLA-Tencor is pleased to be a sponsor of the first China International Import Expo. We invite you to visit our booth #3A5-002 to learn about our company and our inspection, metrology and data analysis systems for the semiconductor and related industries.

The purpose of CIIE is to facilitate countries and regions from all over the world to strengthen economic cooperation and trade, and to promote an overall theme of global trade and world economic growth.
Event Dates Monday, November 5, 2018
Tuesday, November 6, 2018
Wednesday, November 7, 2018
Thursday, November 8, 2018
Friday, November 9, 2018
Saturday, November 10, 2018
Location National Exhibition and Convention Center, Shanghai, China
Booth 3A5-002
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KLA-Tencor is pleased to be an exhibitor and sponsor at SEMICON Europa 2018. We invite you to visit us at our booth #A4407.

SEMICON Europa is the annual premier event for the global electronics industry in Europe. The event covers new products and technologies for electronics design and manufacturing, and features technologies from across the electronics supply chain, from electronic design automation to device fabrication (wafer processing) to final manufacturing (assembly, packaging, and test).
Event Dates Tuesday, November 13, 2018
Wednesday, November 14, 2018
Thursday, November 15, 2018
Friday, November 16, 2018
Location Messe München GmbH, Munich, Germany
Booth A4407