Upcoming events

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KLA-Tencor’s Eric Yang will present an invited talk, “How Can Inspection and Metrology Enable a Zero Defect Strategy for Automotive Packages,” at the SiP Conference China 2018 (Track 8: Test Solutions for Automotive SiP).

The SiP Conference China 2018 provides dynamic learning and technology updates for SiP (system in package) related trends and new engineering innovations from the industry’s world SiP leaders.
Event Dates Thursday, December 20, 2018
Friday, December 21, 2018
Saturday, December 22, 2018
Location Shenzhen Convention and Exhibition Center, Shenzhen, China
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KLA-Tencor will deliver two presentations at SEMICON Korea 2019: “A Systematic Approach to Integrate Metrology and Inspection,” (Poh-Boon Yong) and “Enabling EUV Materials Defectivity Qualification with Unpatterned Wafer Inspection,” (Ming Li). Both presentations are part of the Metrology and Inspection Forum on Thursday January 24, 2019.

SEMICON Korea 2019 will showcase the latest semiconductor materials, equipment and related technologies. Special features include a semiconductor technology symposium, market seminar, supplier search programs and networking events to exchange the latest information.
Event Dates Wednesday, January 23, 2019
Thursday, January 24, 2019
Friday, January 25, 2019
Location COEX Exhibition Center, Seoul, South Korea

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