SEMICON China

KLA invites you to join us at SEMICON® China, where Tomoyasu Cho, VP and President of KLA mainland China, will moderate the Grand Opening Keynote speeches. Our experts will be on hand in Hall N5 Booth 5134 to provide information about our SensArray® in situ process monitoring and control products. Other products are covered in distributor booths. Jipal Corporation (Booth 3101) will be exhibiting wafer-level packaging and component packaging inspectors, and Scientech Corporation (Booth 3319) will show Candela® compound semiconductor inspectors, nanoindenter and profiler instruments, as well as VLSI Standards. Hermes-Epitek China (Booth 3431) covers the CAPRES MRAM metrology products.

KLA is proud to sponsor the Power & Compound Semiconductor Forum March 21-22.

KLA is participating in the SEMI Workforce CXO Talent Forum. Tomoyasu Cho (VP and President KLA mainland China) will speak and Jianou Shi (VP and GM, KLA mainland China) will join the panel discussion. Also, the KLA Human Resources department will organize teams involved in various engineering and technical departments to discuss topics of interest such as talent recruitment and training programs. On-site consultation on the life and career development programs of employees in various departments will be available.

SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market. It is an international trade fair for semiconductor technology that takes place once a year in Shanghai. Since its establishment in 1988, it has developed into the largest and most comprehensive exhibition for the semiconductor industry in China.

Event Dates Wednesday, March 20, 2019 (exhibition)
Thursday, March 21, 2019 (exhibition)
Friday, March 22, 2019 (exhibition)
Booth 5134
Location Shanghai New International Expo Centre, China

CS International Conference 2019

KLA is proud to announce its platinum sponsorship of CS International Conference 2019. In addition to our sponsorship, KLA’s Mukund Raghunathan will present "Advanced inspection and metrology solutions for accelerated compound semiconductor yield improvement".

CS International Conference 2019 is the must-attend industry event for the compound semiconductor industry. The conference will provide an overview of the status of the compound semiconductor industry and the evolution of compound semiconductor devices. CS International 2019 will provide timely, comprehensive coverage of every important sector within the compound semiconductor industry.

Event Dates Tuesday, March 26, 2019
Wednesday, March 27, 2019
Location Sheraton Brussels Airport Hotel, Brussels, Belgium

FCMN 2019

KLA’s Dr. Yalin Xiong is an invited speaker at FCMN 2019, discussing “Advancement on optical inspection technology for 7nm or below process development and manufacturing.”

The 2019 International Conference on Frontiers of Characterization and Metrology for Nanoelectronics will bring together scientists and engineers interested in all aspects of the characterization technology needed for nanoelectronic materials and device research, development, and manufacturing. The conference will summarize major issues and provide critical reviews of important semiconductor techniques needed as the semiconductor industry moves to silicon nanoelectronics and beyond.

Event Dates Tuesday, April 2, 2019
Wednesday, April 3, 2019
Thursday, April 4, 2019
Location Monterey Marriott, Monterey, CA

PhotoMask Japan 2019

KLA’s Dr. Klaus-Dieter Roeth and Dr. Moshe Preil are invited speakers at PhotoMask Japan 2019. Dr. Roeth will discuss “Fast Local Registration Measurements for Efficient e-Beam Writer Qualification and Correction” in Session 4: Writing & Metrology. Dr. Preil will discuss “Open Issues in Mask Technology as EUV Enters High Volume Manufacturing” in Session 9: EUVL II.

PhotoMask Japan 2019 is the 26th international symposium on photomasks and NGL masks. The aim of the symposium is to bring together engineers and investigators from Japan, USA, and all over the world in the field of photomasks, NGL masks, and related technologies to discuss recent progress, applications, and future trends.

Event Dates Tuesday, April 16, 2019
Wednesday, April 17, 2019
Thursday, April 18, 2019
Location Pacific Convention Plaza (“Pacifico”) Yokohama, Yokohama, Japan

NCAP and Yole Développement Symposium

KLA’s Stephen Hiebert will present “Inspection and Metrology Challenges for 3DIC Interconnect Scaling” in the memory session.

For the 5th year, NCAP and Yole Développement will combine their expertise to build an innovative program dedicated to the advanced packaging industry. The program was created to understand the status of the advanced packaging industry and help the companies to be part of the ‘tomorrow’ industry. The Advanced Packaging & System Integration Technology Symposium is unique. Don’t miss it!

Event Dates Monday, April 22, 2019
Tuesday, April 23, 2019
Location Grand Mercure Shanghai Century Park, Shanghai, China

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