EIPBN

The EIPBN show is cancelled amid concerns regarding the Coronavirus (COVID-19).

KLA is a sponsor of the 64th international conference on Electron, Ion, and Photon, Beam Technology and Nano Fabrication (EIPBN). Meet KLA’s Dr. Grace Chen at the Women in Nanofabrication Luncheon on Thursday, May 28, where she talks about “Few Simple Tips Which Fuel Your Success.”

The EIPBN Conference is recognized as the foremost international meeting dedicated to lithographic science and technology and its application to micro and nanofabrication techniques. The conference brings together engineers and scientists from industries and universities from all over the world to discuss recent progress and future trends.

Event Dates Tuesday, May 26 to
Friday, May 29, 2020
Location Sheraton New Orleans Hotel, New Orleans, LA

Taiwan Semiconductor Executive Summit

KLA is a sponsor of the Taiwan Semiconductor Executive Summit (TSES).

Taiwan Semiconductor Executive Summit is an annual meeting and business platform among leading semiconductor manufacturers, equipment & material suppliers and research institutes. TSES is attended by industry thought leaders who are at the forefront of driving technological advancements in a rapidly innovative and changing industry.

Event Dates Monday, June 1 to
Tuesday, June 2, 2020
Location Sheraton Hsinchu Hotel, Hsinchu, Taiwan

Indentation University – Session 15: Complex Modulus of Viscoelastic Polymers

Polymers are exceptionally complex materials—mechanical properties depend on chemistry, processing, and thermo-mechanical history. Instrumented indentation testing dramatically simplifies the mechanical characterization of polymers, because samples can be small and minimally prepared. On bulk materials, values for storage and loss modulus measured by indentation agree well with values measured by dynamic mechanical analysis (DMA).

Register here

Event Dates Wednesday June 10, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)

SEMICON China

KLA is looking forward to exhibiting at SEMICON China. Please visit us at booth E5705 where our experts will be on hand to provide information about our SensArray® in situ process monitoring and control products. Jipal (booth 3131) will host packaging inspection systems, and Scientech (booths 4281, 4741) will cover compound semiconductor inspection and other systems. In addition to exhibiting, KLA is also a proud sponsor of SEMICON China.

SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market. It is an international trade fair for semiconductor technology that takes place once a year in Shanghai. Since its establishment in 1988, it has developed into the largest and most comprehensive exhibition for the semiconductor industry in China.

Event Dates Saturday, June 27 to
Monday, June 29, 2020
Booth E5705
Location Shanghai New International Expo Center and Kerry Hotel, Shanghai, China

Indentation University – Session 16: How to Test Rubber Compounds and Interface Layers in Tire Cross-Sections

Traditional testing of laminate layers in a tire requires extensive dissection and can negatively impact the results. ProbeDMA™ eliminates the need to individually dissect the tire layers and allows the quantification of viscoelastic properties with high spatial resolution across layers and at interfaces. This session is a live demonstration of nanoindentation with the KLA nanoindenter to characterize the viscoelastic properties of tire cross-sections. KLA application engineers will demonstrates sample preparation, instrument configuration, test specification, execution and data interpretation.

Register here

Event Dates Wednesday July 8, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)

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