Taiwan Semiconductor Executive Summit

KLA is a sponsor of the Taiwan Semiconductor Executive Summit (TSES).

Taiwan Semiconductor Executive Summit is an annual meeting and business platform among leading semiconductor manufacturers, equipment & material suppliers and research institutes. TSES is attended by industry thought leaders who are at the forefront of driving technological advancements in a rapidly innovative and changing industry.

Event Dates Monday, June 1 to
Tuesday, June 2, 2020
Location Sheraton Hsinchu Hotel, Hsinchu, Taiwan

Indentation University – Session 15: Complex Modulus of Viscoelastic Polymers

Polymers are exceptionally complex materials—mechanical properties depend on chemistry, processing, and thermo-mechanical history. Instrumented indentation testing dramatically simplifies the mechanical characterization of polymers, because samples can be small and minimally prepared. On bulk materials, values for storage and loss modulus measured by indentation agree well with values measured by dynamic mechanical analysis (DMA).

Register here

Event Dates Wednesday June 10, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)


KLA is looking forward to exhibiting at SEMICON China. Please visit us at booth E5705 where our experts will be on hand to provide information about our SensArray® in situ process monitoring and control products. Jipal (booth 3131) will host packaging inspection systems, and Scientech (booths 4281, 4741) will cover compound semiconductor inspection and other systems. In addition to exhibiting, KLA is also a proud sponsor of SEMICON China.

SEMICON China connects you to the world’s fastest-growing and most dynamic microelectronics market. It is an international trade fair for semiconductor technology that takes place once a year in Shanghai. Since its establishment in 1988, it has developed into the largest and most comprehensive exhibition for the semiconductor industry in China.

Event Dates Saturday, June 27 to
Monday, June 29, 2020
Booth E5705
Location Shanghai New International Expo Center and Kerry Hotel, Shanghai, China

Indentation University – Session 16: How to Test Rubber Compounds and Interface Layers in Tire Cross-Sections

Traditional testing of laminate layers in a tire requires extensive dissection and can negatively impact the results. ProbeDMA™ eliminates the need to individually dissect the tire layers and allows the quantification of viscoelastic properties with high spatial resolution across layers and at interfaces. This session is a live demonstration of nanoindentation with the KLA nanoindenter to characterize the viscoelastic properties of tire cross-sections. KLA application engineers will demonstrates sample preparation, instrument configuration, test specification, execution and data interpretation.

Register here

Event Dates Wednesday July 8, 2020
12:00 pm – 1:00 pm, Eastern Time (US and Canada)


KLA is proud to be a continuing platinum sponsor and exhibitor at SEMICON West. We invite you to visit our experts at booth #144 to learn more about our contact and non-contact profilers and thin-film measurement systems. We also invite you to visit the
SPTS, a KLA Company, booth #827 to learn about their wafer processing technologies solutions. We look forward to seeing you!

SEMICON West is the premier annual event for highlighting the latest innovations, products, processes, and services for the design and manufacture of today’s most sophisticated electronics. It is where the industry gets a glimpse at what is next and finds its innovation engines.

Event Dates Tuesday, July 21 to
Thursday, July 23, 2020
Booth 144, 827
Location Moscone Center, San Francisco, CA

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