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In-Situ Wireless Sensor Wafer

Product Description

The SensArray HighTemp 4mm in-situ wireless wafer temperature measurement solution is designed to optimize and monitor advanced film processes (FEOL and BEOL ALD, CVD PVD) and other elevated temperature processes. The HighTemp 4mm measures process tool thermal uniformity, providing temporal and spatial temperature data collected under real production process conditions. With temperature control in the range of 0.1 degrees Celsius, the SensArray HighTemp 4mm helps drive within-wafer and wafer-to-wafer process uniformity requirements. By revealing thermal variations that can affect process windows and patterning performance, the HighTemp 4mm helps IC manufacturers with the integration of new materials, transistor technologies and complex patterning techniques.

  • Facilitates wireless temperature monitoring and optimization of a wide range of deposition processes
  • Operates within the 20-400 degree Celsius range
  • A 4mm wafer profile enables compatibility with a wider range of process tool types, include track, strip and PVD systems
  • Profiles temperature transitions of multi-temperature, multi-chamber processes
  • Offers comprehensive post-operation data analysis and leverages the learning obtained from other complementary SensArray solutions
  • Provide tool-to-tool and chamber-to-chamber matching for enhanced fleet management, and faster recovery from maintenance activities

The SensArray HighTemp 4mm is critical for helping fab engineers with a range of films process applications, including:

  • Process characterization and tuning
  • Tool qualification
  • Routine process monitoring
  • Equipment troubleshooting
  • Process tool/chamber thermal matching
  • Post-maintenance equipment verification

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HighTemp-350

Extends Temperature Control for Optimization of Deposition Processes in Semiconductor Manufacturing

  • Facilitates wireless temperature monitoring and optimization
  • Operates within the 140-350 degrees Celsius range
  • Profiles temperature transitions of multi-temperature, multi-chamber processes
  • Offers comprehensive post-operation data analysis and leverages the learning obtained from other complementary SensArray solutions
  • Provide tool-to-tool and chamber-to-chamber matching for enhanced fleet management, and faster recovery from maintenance activities


The HighTemp-350 is in-situ wireless wafer temperature measurement solution, designed to optimize and monitor front-end-of-line (FEOL) and back-end-of-line (BEOL) thin film deposition and other elevated temperature processes. The solution provides unique insight into process tool thermal uniformity, and profiles temperature under real production conditions. This capability is critical as process temperature windows are shrinking and alternative approaches cannot adequately characterize raised temperatures. Consequently, IC fabs can experience greater return on investment of the process equipment deployed at the most advanced technology nodes.

New transistor technologies, new materials, and continued scaling are driving tighter process windows. For many processes, temperature control in the range of 0.1 degrees Celsius is critical to meeting within-wafer and wafer-to-wafer uniformity requirements. Current in-situ wireless solutions lack the operating temperature range to address processes above 140 degrees Celsius—critical for advanced thin film deposition. The HighTemp-350 solution meets elevated temperature application requirements, delivering increased value and ease of use compared to wired technology offerings.

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Process Probe 1535 temperature monitoring probe

The Process Probe 1535 instrumented wafer is a temperature monitoring probe ideal for process temperature monitoring of hot wall systems, and oxidizing cold wall environments.

The 1535 temperature monitoring probe can be used in a variety of equipment, monitoring over a wide range of temperatures from 0°C to 1100°C. With exceptional measurement accuracy of the 1535 temperature monitoring probe, you can tighten control parameters, reduce equipment qualification time, calibrate temperature setpoints, and optimize edge to center temperature differentials to minimize wafer stress.

The ThermaBond technique, which embeds the thermocouple sensors into the silicon, delivers unprecedented measurement accuracy and optimum reliability. The 1535 temperature monitoring probe is durable, easy- to-use, and highly versatile to ensure quality improvement.


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Process Probe™ 1535

 

 

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Process Probe 1730SensArray’s Process Probe 1730-instrumented wafers enable precise in-situ characterization of wafer temperature profiles in photoresist track systems, for temperature controlled wafer chuck systems and oven applications. The Process Probe 1730 is ideal for resist bake, polyimide, and SOG applications ranging from –150°C to 300°C.

By utilizing a polyimide film on the thermocouple leads and using a fine gauge lead system, weight imbalance is limited and your wafer will lie flat on your hot plate support pins. You can measure the response time and stabilization of a hot plate, or observe how environmental elements affect temperature uniformity. The Process Probe 1730 is an ideal thermocouple wafer solution for characterizing and fine-tuning your process conditions to improve equipment performance, wafer quality, and yield.

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Process Probe™ 1730
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Process Probe 1630SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond increases the heat transfer, allowing for tight tracking and high accuracy, especially when measuring gas injector temperatures.

By using the Process Probe 1630, you can determine edge-to-center temperature to adjust heater zone setpoints, and measure drift in deposition temperature to adjust for heat transfer changes from oxide build-up on the heaters and belts.

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