Accelerating Reliability for Automotive ICs

KLA-Tencor partners with IC manufacturers, helping to implement proven Zero Defect strategies and best known methods that improve IC quality and stop reliability failures from escaping the fab.

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Semiconductors are at the core of innovation in today’s automobiles, enabling control and monitoring of the mission-critical components of the vehicle, including basic operation and efficiency, safety, advanced driver assistance systems, infotainment, and increasingly, autonomous driving capability. With thousands of ICs in a modern car, chip reliability has become the top quality concern for automakers. To enter the growing automotive market segment – or simply maintain share – IC manufacturers must aggressively tackle chip reliability requirements. Because chip reliability is highly correlated to random defectivity, defect reduction strategies produce chips with higher reliability.

Improvement Program

A continuous improvement program (CIP) leverages unpatterned wafer defect inspection to identify the specific process tools causing defects. With a tool monitoring CIP in place, automotive fabs can set objective targets for reducing the process defects that affect reliability.

Zero Defect

With Zero Defect Screening, fabs monitor 100% of die on all wafers at the critical process steps. This requires an inspector that is fast, sensitive and can reliably identify which defects matter. With this method, die that may fail are removed from the supply chain at the fab where cost is lowest.

Advanced Design
Node Inflection

With automotive features, such as machine vision and AI, requiring advanced ICs, fabs must attain higher yield and quality standards for advanced design node devices. This requires discovery of all systematic defect sources and an “every defect matters” approach to improving baseline yield.


I-PAT (Inline Defect Part Average Testing) is a new method that allows automobile manufacturers to reduce the incidence of latent reliability defects in semiconductor electronic components, recognize at-risk die for exclusion from the supply chain and reduce the incidence of escapes of die that will fail prematurely from the fab. (I-PAT patent pending)

Download the Paper

Automotive Workshops

KLA-Tencor offers workshops to help semiconductor fabs, Tier 1 suppliers and automotive OEMs understand the best known methods for latent reliability defect reduction.

KT Services

Finding all defects relevant to reliability requires inspectors that are in peak operating shape. KT Services delivers the expertise to service highly complex inspection systems, ensuring automotive fabs achieve required uptime with uncompromising sensitivity.

Commentary and Papers

Inline Defect Part Average Testing (I-PAT)

Automotive Electronics Council Reliability Workshop / Apr 2018

Latent Reliability Defects in Automotive Chip Packages

Automotive Electronics Council Reliability Workshop / Apr 2018

Finding Faulty Auto Chips

Semiconductor Engineering / Mar 2018

Automotive IC Industry Trends

Semiconductor Engineering / Jan 2018

Radar Versus LiDAR

Semiconductor Engineering / Oct 2017

Foundries Accelerate Auto Efforts

Semiconductor Engineering / Jul 2017