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Product Description

The WI-22x0 Series systems enable automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, supporting wafer-level packaging and post-dicing quality control for MEMS, LED, image sensor and other integrated circuit applications. With both inspection and 2D/3D metrology capability, the WI-22x0 Series automated optical inspection and metrology systems provide feedback on the surface quality of wafer; the quality of wafer dicing; or, critical dimension and overlay quality of bumps, pads and copper pillars. The WI-22x0 Series automated optical inspection and metrology systems are designed with IRIS (ICOS Review and Classification Software) which offers online and offline defect review and reclassification, for faster yield learning and improved process control.

  • Highly flexible advanced optical modes with dedicated image processing enable high capture rate of defects
    • Post-bonding front side inspection: capture of defects such as contaminated sensors, abnormal etch, glass cracks, glass chips, and epoxy overflow
    • Post-dicing back side inspection: capture of defects such as lead opens, lead shorts, lead holes and bridged bumps
  • Inline Rules Based Binning (RBB) and defect classification delivers faster time to information
  • 2D and 3D metrology offers additional yield-relevant actionable data, including critical dimension and overlay measurements for bumps, pads and pillars, with no impact to throughput
  • Whole wafers in carriers and diced wafers in hoop rings or film frame carriers can be handled without any hardware changeover
  • Wafer sizes from 2” to 8” are supported

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