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Substrate Metrology and Substrate Inspection Systems
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Product Description

The Candela 63xx series delivers best-in-class substrate metrology and substrate inspection capabilities for data storage substrates and finished media. The Candela 63xx substrate inspection and substrate metrology solution leverages the industry's widest spatial bandwidth coverage (from 0.22 microns to 2,000 microns) and a noise floor below 0.5 angstroms to satisfy emerging requirements for comprehensive roughness and micro-waviness measurements. The Candela 63xx substrate inspection and substrate metrology solution also harnesses patented multi-channel optics, combined with unique laser stability management technology, to deliver powerful substrate metrology capabilities for edge roll-off and texture/polish uniformity, as well as scratch and particle inspection. The Candela 63xx substrate inspection and substrate metrology solution is a manual system suited for laboratory and low volume production, and the Candela 6320 substrate inspection and substrate metrology solution is an automated fully automated cassette-to-cassette system for production environments.

Application

Roughness and waviness analysis, defect inspection, scratch and ridge inspection, texture and polish metrology, particle and stain inspection

For more information on the Candela 63xx substrate inspection and substrate metrology solution contact our authorized sales representatives in the United States, Asia or Europe. For inquiries, please contact our Sales, Service, or Applications teams.

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Candela 6300