3D Surface Profilometer and Optical Interferometer

MicroXAM -100 3D Non-Contact Surface Profilometer Optical Interferometer  MicroXAM -100
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The KLA-Tencor Development Series of 3D surface profilers offer a complete optical surface profilometer and optical interferometer solution focusing on the needs of the engineering and research community. Our 3D surface profiler and optical interferometer products are designed to match the varied requirements of our customers through the delivery of full featured 3D surface profiler and optical interferometer products, integration of new technologies, and improved performance.

  • 250 μm closed loop vertical range
  • PSI (phase) and VSI mode (vertical)
  • 100mm x 100mm manual sample positioning stage (optional 100mm x 100mm motorized stage)
  • Solid State light source
  • Optional stitching and auto alignment of images
  • Windows XP and Vista compatible

The MicroXAM-100 3D surface profiler and optical interferometer complements our optical surface profilometer portfolio by combining white light and phase-shifting optical interferometry for precise, non-destructive 3D surface profilometer that are internally and permanently referenced to a standard wavelength of light. The 3D surface profilers and optical inteferometer system provides precise, high-resolution, non-contact 3D surface profiles of both smooth and rough surfaces. The 3D surface profilometer and optical interferometer system provide an intuitive Windows user interface allows simple and reproducible program navigation.

The MicroXAM -100 3D surface profilometer and optical interferometer can measure fields of view from 100 X 100 microns to 2.0 X 2.0 millimeters (dependent on the objective lens used). The MicroXAM 3D surface profiler and 100 optical interferometer quickly and accurately measures the 3D topography of surface profiles at the nanometer level with 0.1 nm z-resolution (scan setup dependent) a z-scan range of 250 microns (or up to 10 mm with Z-Stitching). With the new 3D image stitching capabilities, multiple images can be stitched together to produce an extended fields of view.

  • Surface Texture
  • Precision step height
  • Surface form
  • Thin film stress
  • Biological
  • MEMS
  • 3D surface profile imaging
  • Material Characterization
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