Product Description

The WI-2200 and -2300 Wafer Inspectors perform 100% automated optical inspection and metrology of microelectronic devices on a variety of wafer substrates, surface inspection, and 2D bump inspection. Key market segments for this automated optical inspection system include semiconductor IC, optoelectronics, advanced packaging, and MEMS.

The WI-2200 is a manual loading system, and inspects any wafer type without hardware changeover, including whole wafers from 2 to 8 inches, diced wafers on FFC and on a hoop ring. The WI-2300 optical inspection system is fully automated, and measures whole wafers from 8" to 12 inches. Both of these automated optical inspection systems offer IRIS (ICOS Review and Classification Software) which offers on and offline defect review and reclassification, as well as offline reclassification capability on any other PC.


  • Surface inspection
  • 2D bump inspection
  • Probe mark inspection

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