Share

HighTemp-350

Extends Temperature Control for Optimization of Deposition Processes in Semiconductor Manufacturing

  • Facilitates wireless temperature monitoring and optimization
  • Operates within the 140-350 degrees Celsius range
  • Profiles temperature transitions of multi-temperature, multi-chamber processes
  • Offers comprehensive post-operation data analysis and leverages the learning obtained from other complementary SensArray solutions
  • Provide tool-to-tool and chamber-to-chamber matching for enhanced fleet management, and faster recovery from maintenance activities


The HighTemp-350 is in-situ wireless wafer temperature measurement solution, designed to optimize and monitor front-end-of-line (FEOL) and back-end-of-line (BEOL) thin film deposition and other elevated temperature processes. The solution provides unique insight into process tool thermal uniformity, and profiles temperature under real production conditions. This capability is critical as process temperature windows are shrinking and alternative approaches cannot adequately characterize raised temperatures. Consequently, IC fabs can experience greater return on investment of the process equipment deployed at the most advanced technology nodes.

New transistor technologies, new materials, and continued scaling are driving tighter process windows. For many processes, temperature control in the range of 0.1 degrees Celsius is critical to meeting within-wafer and wafer-to-wafer uniformity requirements. Current in-situ wireless solutions lack the operating temperature range to address processes above 140 degrees Celsius—critical for advanced thin film deposition. The HighTemp-350 solution meets elevated temperature application requirements, delivering increased value and ease of use compared to wired technology offerings.

Contact Me >