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Process Probe 1630SensArray Process Probe 1630 instrumented wafers enable precise in-situ characterization of wafer temperature profiles in both front-end atmospheric and belt CVD systems, and in back-end wafer solder bumping reflow ovens. Utilizing the patented ThermaBond technique, the embedded thermocouple bond increases the heat transfer, allowing for tight tracking and high accuracy, especially when measuring gas injector temperatures.

By using the Process Probe 1630, you can determine edge-to-center temperature to adjust heater zone setpoints, and measure drift in deposition temperature to adjust for heat transfer changes from oxide build-up on the heaters and belts.

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