Process Probe 1730SensArray’s Process Probe 1730-instrumented wafers enable precise in-situ characterization of wafer temperature profiles in photoresist track systems, for temperature controlled wafer chuck systems and oven applications. The Process Probe 1730 is ideal for resist bake, polyimide, and SOG applications ranging from –150°C to 300°C.

By utilizing a polyimide film on the thermocouple leads and using a fine gauge lead system, weight imbalance is limited and your wafer will lie flat on your hot plate support pins. You can measure the response time and stabilization of a hot plate, or observe how environmental elements affect temperature uniformity. The Process Probe 1730 is an ideal thermocouple wafer solution for characterizing and fine-tuning your process conditions to improve equipment performance, wafer quality, and yield.

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Process Probe™ 1730