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Multifunction Measurement System for 250nm Design Rule
ultragage9700

Product Highlights

  • The standard for wafer dimensional metrology
  • Measures 17,300 data points in 60 seconds
  • Edge exclusion to 2mm
  • E technology emulation
    • Pass/Fail Sorting
    • Applications
    • Polished wafers
  • Patterned wafers
  • MEMS substrates
  • Broad range of options
    • Type
    • Stress
    • SECS

The UltraGage 9700 system with E-Plus technology is the industry standard for 250nm design rule characterization. It meets SIA performance requirements for 200mm wafer processing, edge exclusion and site flatness. The 9700 is ideal for checking outgoing wafer quality at silicon manufacturers. In IC fabs, it is also useful for sampling wafers at incoming quality and photolithography. High data density, non-contact measurements and fully automated operation makes the 9700 an ideal process analysis, development and control tool. With its broad range of capabilities, including 2mm edge exclusion an optional wafer typing gage and, the 9700 is versatile and expandable for future needs.

Silicon Manufacturing
The UltraGage 9700 system is the standard for dimensional metrology in the silicon wafer industry. With E technology emulation, the 9700 characterizes wafers for both 250nm and greater line widths. Tighter accuracy and repeatability of the 9700 translates into higher yields at final inspection. Optional features such as automatic thickness calibration, sorting using a dual handler and storable calibration parameters reduces cost of ownership.

Lithography
Global and site flatness data can be used to predict photolithographic yield based on wafer geometry. Reference site and global focus plane combinations can be selected to optimize stepper leveling and focus characteristics. Site layout, size, offset and reference planes of a stepper recipe can be emulated to improve lithographic yield.

Incoming Quality Control
Using our industry standard measurements, the 9700 can identify out of specification wafers before they cause yield loss in downstream processes. Supplier quality can be checked and monitored.

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Thickness Map

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