Share
Wafer Thickness, Shape Stress, and Site Flatness Measurements


Product Highlights

  • Multi-tool functionality including wafer thickness, shape stress measurements, global and site flatness measurements
  • Measures 8,700 data points in under 60 seconds
  • Thin film measurements stress on patterned or monitor wafers
  • Wide range of options including wafer typing

The 9500 UltraGage is a versatile, multifunctional site measurement tool that measures wafer thickness, shape stress, and wafer flatness. Using the industry standard E-Gage technology, the 9500 UltraGage site measurement tool is ideal for characterizing wafers used by mature fabrication processes. Applications include outgoing wafer quality checks at silicon wafer manufacturers, sampling incoming wafer quality at IC fabs, thin film stress measurements and shape of wafers used in thermal processes. High data density, non-contact measurements and fully automated operation make the 9500 UltraGage site measurement tool an ideal full functional wafer analysis, development and control tool. A wide selection of optional capabilities including wafer typing, stress measurement and off-line analysis software allow the 9500 UltraGage site measurement tool to be used in a wide variety of applications.

Multi-Tool Functionality
As either a standalone gage, or with its optional cassette handler, the 9500 UltraGage site measurement tool offers a variety of measurements not usually found in a single tool. Wafer thickness, shape stress measurements, global and site flatness measurements can be used in many applications from incoming quality control to backgrind. Moreover, stress measurement and off-line analysis software can be added eliminating the need to purchase a separate stress measurement tool.

Site Flatness Measurement
Standard on the 9500 UltraGage site measurement tool, real time site flatness measurements can be used to qualify wafers for their suitability for lithographic processes. Site size and offset can be varied to qualify the wafer flatness measurements of user specific image layouts, preventing out of specification wafers from entering the IC fabrication process.

Stress Measurements
The 9500 UltraGage site measurement tool's optional stress measurement is not sensitive to film type, reflectivity or other optical aberrations found in optically based stress measurement systems. The large number of data points results in highly detailed stress measurements to within 3 mm from the edge.

ultragage9500-1

Wafer Thickness Map Site Map.

ultragage9500-2
Site Map

Contact Me >


Related Information