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Darkfield Patterned Wafer Inspection Systems
puma91xxseries

Product Description

The Puma 91xx Series is a family of laser imaging, darkfield patterned wafer inspectors that effectively disposition wafers and improve the predictability of the chipmaking process by capturing critical defects at high production throughputs. Part of a fab's yield management strategy, the Puma 91xx tools provide excursion monitoring capability for memory and logic devices at the 55/45nm nodes and beyond.

  • Unique optical modes and multiple pixel options provide broad defect type capture at required speed for a range of process layers
  • High production throughputs at required sensitivity enable increased lot sampling or lower cost of ownership
  • Modular design allows various tool configurations, namely Puma 9130 and Puma 9150, spanning applications from tool monitoring to advanced etch and photo
  • Commonality and connectivity with other KLA-Tencor inspectors and review tools optimize inspector capacity and reduce production integration time
  • Established tool architecture and production-proven tool matching produce consistent and reliable excursion monitoring results

Applications

Films: Unique optical features on the Puma 91xx Series wafer inspectors produce superior nuisance suppression and surface selectivity. These capabilities and high production throughputs provide cost-effective defect detection on all films layers

CMP: Flexible polarization options on all Puma 91xx Series inspectors minimize the effects of color variation, while the new optical modes of the Puma 9150 increase the detection of yield-limiting CMP defect types. Tool monitoring with the Puma 91xx wafer inspectors is fast and sensitive, helping to reduce the yield-loss associated with CMP interconnect processes.

Etch: The Puma 91xx’s laser imaging technology provides the resolution necessary to detect pattern defects (bridging, shorts) on etch layers. The higher throughput Puma 91xx inspectors are used for non-critical etch excursion monitoring, while the higher sensitivity broadband brightfield inspectors address critical etch line monitoring applications.

Photo : With high resolution darkfield imaging and multiple optical modes, the Puma 91xx wafer inspection systems capture critical photo defects at high throughputs while effectively suppressing prior-level defects. Puma complements higher sensitivity broadband brightfield inspections by providing an improved sampling option for photo-cell monitoring and after-develop inspection.

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