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Overlay Metrology System
 

Product Description

The Archer™ 300 LCM is a high performance, low cost-of-ownership overlay metrology system for 2Xnm logic and 1Xnm half-pitch memory devices. Offering high precision, fast measurement speed, and in-field metrology capability, the Archer 300 LCM meets the specifications required to qualify scanners and control high volume manufacturing across multiple technology nodes. Upgradeable from existing Archer metrology tools, the Archer 300 LCM provides cost-effective characterization of overlay error for double patterning and other process technologies.

  • Improvements to the optical subsystems produce better overlay measurement specifications relative to the previous-generation Archer 200, including:
    • Tighter precision and total measurement uncertainty (TMU)
    • Better measurement repeatability
    • Faster move-acquire-measure (MAM) time and throughput
    • Improved matching
  • In-field overlay measurement capability, enabled by the smaller AIMid™ target, helps chipmakers implement high-order scanner corrections to ensure accurate patterning
  • Seamless integration with K-T Analyzer™, an advanced overlay analysis system, provides immediate feedback on the quality of the lithography process and real-time data for overlay error corrections
  • Connectivity with Recipe Database Manager (RDM), a centralized database of production-proven recipe components, improves fab productivity by reducing setup time and increasing the reliability of measurement recipes
  • Upgradeability from the previous-generation Archer 200 and extendibility to other metrology capabilities protect fabs’ capital investments
 

Applications

Double Patterning Technologies: The implementation of double patterning technologies reduces the tolerable overlay error to just a few nanometers at sub-32nm design nodes. The Archer 300 LCM’s improved optical subsystems provide the tighter precision and TMU specifications required to measure overlay error on double-patterning layers. In addition, lithographers can cost-effectively take more measurements across the wafer using the smaller AIMid target and the Archer 300 LCM’s increased measurement speed. This increased measurement sampling enables improved process characterization and better process control for double patterning technologies.

Scanner Qualification: The Archer 300 LCM overlay metrology system provides the high performance overlay measurement capability required to qualify scanners to ensure accurate patterning on 2Xnm design node devices. With fast measurement speed and the use of smaller AIMid targets, the Archer 300 LCM can take more measurements across the wafer, generating the data required to instruct the scanner to make complex, higher-order corrections. These higher-order corrections are required to manage the tighter overlay tolerances encountered at 2Xnm design nodes.

In-line Monitoring: The Archer 300 LCM’s integration with the K-T Analyzer overlay analysis system provides accurate wafer lot disposition, helping lithographers reduce unnecessary wafer rework and the cycle time required to address variations in lithography tool performance.