The WaferSight 2's proprietary dual-sided interferometer measures wafer geometry parameters such as thickness, shape and flatness. The wafer geometry data from WaferSight 2 dual-sided interferometer, acquired in 3D, is capable of delivering best-of-industry nanotopography and wafer edge roll-off metrology by utilizing high quality optics in an efficient package, resulting in shorter cycle times, reduced WIP queuing, and more efficient facilities usage.  The WaferSight 2 dual-sided interferometer helps both IC companies and wafer makers by enabling tighter flatness specifications for bare wafers, helping chipmakers to overcome depth of focus challenges. The WaferSight 2 dual-sided interferometer's superior optical quality permits excellent tool to tool matching

Applications

Production Flatness, Thickness and Shape Quality Control

Production wafer shape and geometry metrology provides sub-nm site flatness (SFQR) precision for leading edge design nodes. Industry-leading performance helps wafer manufacturers increase yield, and reduces chipmakers' uncertainty and risk with incoming wafers. Bare wafer flatness is measured after polish in the wafer fab, and IC manufacturers use the WaferSight 2 dual-sided interferometer for incoming quality control of bare wafers.

Edge Roll-Off Option

Wafer manufacturing issues can affect geometry at the edge of the wafer, causing die defocus and CMP removal non-uniformity. The WaferSight 2 dual-sided interferometer generates edge roll-off reports to control wafer to wafer edge roll-off as well as angular variations.

Nanotopography Option

Nanotopography can have implications in post CMP film thickness uniformity, as well as CD uniformity.  The WaferSight 2 dual-sided interferometer is the first metrology system to produce artifact-free chuckless nanotopography plots of frontside and backside wafer surfaces in a single, non-destructive measurement. This nanotopography parametric qualification data is more cost effective on a single platform.