KLA-Tencor’s wafer manufacturing tools include inspection, review, metrology and data management systems. Specialized inspection tools assess surface quality and detect, count and bin defects during the wafer manufacturing process and as a critical part of outgoing inspection. Wafer geometry systems ensure the wafer is extremely flat and uniform in thickness, with precisely controlled surface topography. Specifications for wafer defectivity, geometry and surface quality are tightening as the dimensions of transistors become so small that the properties of the substrate can substantially affect transistor performance.

Surface and Defect Inspection

• Surfscan SPx: Defect and surface quality inspection systems for polished wafers, epi wafers and engineered substrates
• SURFmonitor: Defect/metrology module to monitor process drift and capture low-contrast defects, for use with Surfscan SP2-family systems
• VisEdge: Edge inspection systems

Defect Review

• eDR-5210: SEM-based defect review and classification system

Wafer Geometry and Nanotopography Metrology

• WaferSight: Wafer thickness, shape and flatness metrology systems
• SURFmonitor: Optional module for Surfscan SP2-family systems indicating sub-Angstrom surface topography variation on bare substrates

Data Management

• FabVision: Data management system for wafer manufacturing factories
• Klarity Defect: Data management and analysis modules