Photo GalleryPhoto Gallery

Product Description

The HRP-250 is an automated, advanced surface topography metrology tool, featuring high resolution/high-aspect ratio, stylus-based surface profiling for leading edge 200mm applications. Its ultra-fine 20nm stylus tip option enables down to 45nm-generation surface profiling at cost-effective throughputs for critical transistor and interconnect applications. Featuring diamond styli down to 20nm radius and a lower-noise platform for enhanced measurement sensitivity, the HRP-250 surface topography profiling system offers nanometer-scale stylus technology which matches AFM resolution - without modeling requirements. In addition to the 200mm HRP-250 surface topography profiling system, a 300mm HRP-350 is also available for IC semiconductor manufacturing applications.

Application

• High-resolution mode enables accurate control of nano-scale features for applications that directly impact device performance, such as Shallow Trench Isolation, CMP in the interconnect, metal film roughness and tungsten plug recess.
• Long-scan mode operates at high throughput to measure Cu CMP dishing and erosion, copper plating, die planarity, and C4 bump height in packaging.

Contact our authorized sales representatives in the United States, Asia or Europe and the Middle East, or send an This e-mail address is being protected from spambots. You need JavaScript enabled to view it to our support team.

Contact Me >