Product Description

Benefits:

• 300mm industry standard wafer shape measurements
• Measures etched, polished, epi, SOI and reclaim wafers
• High throughput and sorting
• Worldwide wafer shape measurement correlation

Features:

• Reliable edge grip handling
• Integral NIST traceable masters
• 1mm edge exclusion
• 300mm factory automation compliant
• Bulk resistivity and conductivity type options

Advanced Flatness System
ADE's AFS™ Advanced Flatness System is the industry standard production and metrology tool for measuring thickness, flatness and shape of 300mm silicon, epi and SOI wafers. This wafer shape measurement system provides accurate and precise measurements supporting the 130nm and 90nm site flatness (SFQR) technology nodes. The AFS system offers the optimal combination of wafer shape measurement accuracy, clean handling, and high throughput for production wafer flatness and shape measurements.

AFS measures CMP process results on 300mm double side polished wafers down for 130nm design rules and beyond. This wafer shape measurement system has been certified to be compatible with CMP process control and quality control needs. Providing a precision polished flat surface is indispensable for maximum die yield in integrated circuit lithography.

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