Defect Inspection

Reticle

TeraStar
High-sensitivity Reticle Inspection

Product Description

TeraStar combines a three-fold increase in throughput (compared to previous inspection platforms) and 100-nm defect capture to address stringent requirements for advanced reticles used in high-volume integrated circuit production. Its high throughput and sensitivity make it an ideal system for pre- and post-pelliclization inspection in photomask manufacturing operations, as well as for incoming quality control and re-qualification in wafer fabs.

  • Comprehensive defect detection on advanced reticles with OPC and PSM features.
  • Newest evolution of KLA-Tencor's widely adopted STARlight™ technology.
  • Provides both die-to-die and die-to-database inspection.
  • Provides concurrent multiple-inspection capability.
  • Enables detection and disposition of very small energy flux variations on the reticle.
  • Maintains high productivity inspection with low false and nuisance defects on most PSM designs.
  • Inspection of the pellicle surface and backside of reticles.
  • High resolution provides superior review images.
  • Assesses reticle defect printability with offline simulation software for more accurate defect dispositioning.

Application

OPC/PSM Inspection: The new XPA algorithm enables inspection of OPC assist features and model-based OPC designs without limitation on attenuating, alternating, and tritone PSM.

CD Error Detection: Reticle CD defects, when found in low k1 lithography, can be magnified onto the wafer with greater printability. The XPA algorithm provides protection from these defect types by detecting localized CD variations caused by resist defects and systematic CD errors such as writer butting and placement errors.

Outgoing Qualification: TeraStar's high sensitivity and throughput make it the ideal system for pre and post- pelliclization inspection in photomask manufacturing operations.

Incoming Qualification (IQC): In fab IQC, TeraStar inspects advanced reticles for all defect types in a single pass, providing incoming certification before putting the reticle into production.

Reticle Re-qualification: In a STARlight™/URSA configuration, TeraStar provides high-speed reticle inspection for high frequency monitoring of critical layer reticles susceptible to degradation from DUV exposure. The system detects electrostatic discharge (ESD), crystal growth, particles, and semitransparent defects that occur during a reticle's useful life in production.

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